Application Engineer, High-Speed Interconnects

3M

Remote

Quick summary

Work type
Remote
Location
Remote
Salary
$145,676–$178,049 / yr
Posted
4 days ago

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $185k
This role $162k
$131k most similar roles pay here $228k

This role pays less than 72% of similar roles. Most pay $157,650–$213,281 — the shaded band above. At the midpoint, this role pays about $162k versus about $185k for comparable roles.

Based on 240 similar postings.

Employer

About 3M

3M is a diversified technology and manufacturing conglomerate producing thousands of products across healthcare, safety, electronics, transportation, and consumer goods. Industry: Diversified Manufacturing

3M currently has 48 open roles on FindRole.

Listed pay typically runs $145,676–$178,049 across 43 roles with salary data.

Most-posted roles

View all roles at 3M

At a glance

TL;DR · Application Engineer, High-Speed Interconnects

As a Customer Facing Application Engineer – High-Speed Interconnects at 3M, you will serve as the technical liaison between the company and customers for high-speed interconnect solutions, focusing on optical fiber technologies. Your responsibilities include supporting customer design-in activities, providing technical consultation, driving product adoption by understanding customer needs, collaborating with internal teams to influence future product direction, and leading technical discussions and demonstrations. You will also develop test plans, resolve field issues, contribute to documentation, and monitor industry trends in optical fiber interconnects and high-speed data communication. The ideal candidate has a bachelor’s degree or higher, three years of experience in customer-facing roles, and strong knowledge of optical fiber interconnects, transceiver connectivity, and copper interconnects for high-speed systems. Experience with laboratory test equipment and data center architecture is also required.

What you'll do

  • Provide technical consultation on product selection and system integration for high-speed interconnect solutions.
  • Support customer design-in activities for fiber optic connectivity and optical transport systems.
  • Drive adoption by understanding customer architectures and next-generation roadmap needs.
  • Lead technical discussions, demonstrations, and evaluations involving optical and copper interconnects.
  • Assist in resolving field issues through hands-on problem-solving and cross-functional coordination.
  • Develop test plans and analyze results to ensure customer requirements are met with validated data.
  • Contribute to technical documentation and training materials for product deployment support.

What we're looking for

  • Bachelor’s degree or higher from an accredited institution
  • Three years of experience in customer-facing technical roles
  • Two years of experience with high-speed interconnect technologies (optical fiber and/or copper)
  • Strong knowledge of optical fiber interconnects, transceiver connectivity, and data center infrastructure
  • Experience interpreting industry standards for fiber optic and electrical interconnect components
  • Familiarity with data center systems architecture and networking environments
  • Ability to analyze customer requirements and provide technical guidance

More like this

Similar roles

Application Engineer, High Speed Interconnects

3M

Remote (IL) 4 days ago $145,676$178,049
optical fiber interconnects fiber optics for communications systems copper interconnects data center systems architecture networking AI infrastructure high-performance computing environments industry standards qualification requirements test methods laboratory test equipment performance characterization technical presentations
Remote

Server Project Engineer

Qualcomm

Santa Clara, CA 18 days ago $233,000$349,600
ARM SoC High Performance Computing Power Management Chiplet Infrastructure Memory Systems Coherent Interconnects CPUs Design Verification Silicon Test Post-Silicon Validation Thermal Design Compliance Certifications Engineering Tradeoff Analysis Data Center Solutions KPI Metrics Cross-Functional Collaboration

NoC Interconnect Design Engineer and Architect

Qualcomm

San Diego, CA 14 days ago $115,600$173,400
AHB AXI CHI network_on_chip architecture_tradeoff_analysis ASIC_flow synthesis STA Lint power_tools RTL_design FPGA_debug post_silicon_debug performance_power_area_tradeoff