3D IC and SoC CAD Engineer

What you'll do

• Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
• Lead hands-on debug and automation for large chip-level physical and logical netlists.
• Partner with EDA vendors to define 3D-IC feature requirements and AI co-development opportunities.
• Develop and integrate ML-based optimization, predictive modeling, and LLM-assisted automation into CAD flows.
• Define strategies and initiatives to ensure flows meet requirements for future technology nodes.
• Regress methodology and analyze results to develop capabilities that improve quality of results.
• Deliver tools and flows to design teams that meet key Timing, Area, and Performance metrics.

What we're looking for

• Bachelor's or Master's degree in Computer Engineering or Electrical Engineering.
• Strong silicon hardware design background.
• Scripting proficiency in Python, TCL, and Perl within a Linux/Unix environment.
• Hands-on experience applying machine learning to CAD or EDA workflows.
• Strong understanding of industry EDA tools, specifically place-and-route, extraction, and analysis tools (preferred).
• Familiarity with chip- or system-level netlists and ability to debug connectivity across industry-standard formats (preferred).
• Exposure with system-level design verification processes including LEC, LVS, and DRC (preferred).
• Experience with advanced-node tapeouts across silicon technologies (preferred).