Technical Program Manager, Image Sensor & Process Integration

What you'll do

• Set aggressive yield targets and drive plans to achieve constant product quality and operational improvements.
• Drive yield improvements through careful data analysis and process development during product development and ramp.
• Ensure products are designed for manufacturing (DFM) from the initial product concept stage.
• Approve vendor process flows, quality control plans, equipment lists, and qualification plans.
• Manage new process introductions and oversee special projects related to semiconductor device processes.
• Lead the resolution of device-related quality issues in wafer fab, back-end processing, and transit.
• Drive Failure Analysis (FACA) for sensor-related returns and track issues to timely closure.
• Manage quality relationships with image sensor vendors through regular reviews, reporting systems, and audits.

What we're looking for

• MS or PhD in Electrical Engineering, semiconductor devices, or an allied technical subject.
• 7+ years of technical understanding of semiconductor devices, including problem solving and root cause analysis in pressured environments.
• Good working knowledge of semiconductor devices and associated module components (e.g., silicon processing or III-V) (preferred).
• Understanding of semiconductor processes (etch, litho, etc.), wafer test, yield, wafer fab process integration, wafer packaging, and back-end issues (preferred).
• Familiarity with quality systems and quality control (preferred).
• Interpersonal skills of leadership, communication, teamwork, project management, and influencing (preferred).
• Flexibility to work evenings and weekends and ability to travel internationally (preferred).