Software and Engineering Intern, Imaging and Print

HP Inc.

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Corvallis, OR
Employment
Intern
Posted
26 days ago
Freshness
Confirmed live today
Closes
Mar 30, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $196k
$138k $253k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $168,500–$224,450.

Based on 240 similar postings.

Employer

About HP Inc.

HP Inc. is a global technology company that develops and sells personal computers, printers, and related supplies and services. Its products include laptops, desktops, workstations, and printing solutions for consumers and businesses worldwide.

HP Inc. currently has 115 open roles on FindRole.

Listed pay typically runs $130,700–$205,200 across 95 roles with salary data.

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At a glance

TL;DR · Software and Engineering Intern, Imaging and Print

Software and Engineering Intern Roles - Imaging and Print offers students the opportunity to join the HP Imaging, Printing & Solutions team for a twelve-week summer internship. Interns will work on big projects to shape the future of print through consumer, commercial, and industrial solutions. Depending on the specific area of interest, responsibilities include circuit design, firmware development, mechanical design, data analysis, and software testing. Required technologies and skills vary by track, including Python, C/C++, Java, JavaScript, MATLAB, SQL, and Git, alongside tools like SolidWorks, AutoCAD, and JMP Statistical Software. Candidates will solve technical problems involving print-system design, hardware controls, and manufacturing processes. The role requires a technical degree and the ability to perform root cause analysis, prototyping, and system integration within a cross-functional engineering environment.

What you'll do

  • Execute "big meaty projects" to solve real-world engineering and software challenges.
  • Perform root cause analysis, testing, and data analysis to improve product reliability.
  • Develop hardware, firmware, or software components using languages like Python, C++, or Java.
  • Design mechanical components or electrical circuits using CAD, 3D modeling, or PCB design tools.
  • Plan experiments, analyze technical data, and document engineering findings for stakeholders.
  • Troubleshoot and debug complex systems across mechanical, electrical, and software disciplines.
  • Create executive-level presentations to storyboard and deliver technical results to peers and leadership.

What we're looking for

  • Must have completed at least the 3rd year of a university degree or the 1st year of a Master's degree.
  • Must have no more than 24 months of professional work experience related to the specific internship role.
  • Preferred majors include Computer Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, Chemical Engineering, Materials Science, Mechatronics Engineering, or AI/Data Science.
  • Preferred to have project experience demonstrating strong analytical, modeling, and research skills.
  • Preferred to have strong executive-level presentation skills, including storyboarding, development, and delivery.
  • Preferred to have demonstrable success delivering results in a cross-functional team setting.
  • Preferred to have the ability to handle ambiguity and unstructured work situations.

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