SOC Thermal Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Austin, TX
Posted
11 days ago
Freshness
Confirmed live yesterday

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How this pay compares to similar roles

Similar $205k
$137k $277k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $176,200–$233,050.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3552 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2742 roles with salary data.

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At a glance

TL;DR · SOC Thermal Engineer

The SOC Thermal Engineer will join a multi-functional team to optimize thermal performance for mobile devices and participate in advanced IC packaging research and development. The role involves designing and validating cooling solutions for high-performance computing systems, specifically addressing chip energy efficiency and performance scaling. Key responsibilities include providing thermal modeling solutions at silicon die and semiconductor package levels, analyzing simulation and measurement results, and integrating cooling solutions into next-generation SOC architecture designs. Candidates must possess expertise in thermal design for silicon devices, IC physical design parameters, and low-power design techniques. Required technical skills include proficiency with industry-standard tools such as Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk to perform thermal analysis, validation, and experimental test setup for high-power SoCs.

What you'll do

  • Design and validate cooling solutions for high-performance computing systems.
  • Perform thermal analysis and design solutions to improve chip energy efficiency and performance scaling.
  • Provide thermal modeling solutions for mobile devices at silicon die and semiconductor package levels.
  • Analyze simulation and measurement results to enhance product thermal management.
  • Integrate cooling solutions into next-generation SoC architecture designs.
  • Execute experimental test setups and analyze resulting thermal data.
  • Validate thermal performance and reliability across various product lines.

What we're looking for

  • Bachelor's degree required.
  • Demonstrated leadership capabilities at the senior engineer level (preferred).
  • Deep expertise in thermal design for silicon devices and packaging solutions (preferred).
  • Proven experience with IC physical design parameters and their impact on electrical and thermal performance (preferred).
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches (preferred).
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics (preferred).
  • Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs (preferred).
  • Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk (preferred).

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