Qualcomm is hiring a Senior Mechanical Engineer to join its IoT HW design team in San Diego, CA, where the candidate will play a pivotal role in the mechanical design of various IoT form factor product platforms. This position involves collaborating with ODM/OEM partners and internal teams across geographical regions to develop next-generation IoT industrial hardware applications. Day-to-day responsibilities include detailed mechanical design using 3D CAD tools like CREO, creating manufacturing drawings, sourcing components such as plastic housings and sheet metal chassis, and ensuring designs are manufacturable. The ideal candidate has a BSME or equivalent degree and at least three years of professional experience in mechanical engineering, proficiency with 3D CAD software, and expertise in designing CNC machined, sheet metal, die-cast, and injection-molded components. Additionally, strong skills in thermal analysis, structural FEA tools, tolerance stack analysis, and data-center chassis design are essential for this role within Qualcomm’s fast-paced and innovative environment.
Skills
CREO
SolidWorks
3D CAD tools
Flowtherm
Icepak
FEA tools
PDM systems
Agile
GD&T
tolerance stack analysis
test/assembly fixture design
mechanical documentation
plastic injection molding
die cast
chassis sheet metal
CNC machining
PCB assembly constraints
What you'll do
Design and develop mechanical IoT product form factor platforms.
Own detailed mechanical design including 3D CAD models and manufacturing drawings.
Coordinate with vendors to source prototype and production components.
Develop thermal, structural, and tolerance analyses of mechanical assemblies.
Interface with ODM/OEM partners to define next-gen IoT industrial HW applications.
What we're looking for
BSME or equivalent from an accredited college
3+ years of professional mechanical engineering experience
Proficiency with 3D CAD tools like CREO
Experience designing CNC machined, sheet metal, die-cast, and injection-molded components
Working knowledge of mechanical documentation, tolerancing, and GD&T
Strong understanding of thermal and structural analysis using software like Flowtherm or Icepak
Effective communication skills for collaboration with multi-disciplinary teams
Market check
Salary context
This
$101,400–$152,200
range sits above
10%
of similar postings on FindRole.
Peer median band
$117,000–$199,700
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$135,702–$184,900
Middle half of comparable postings.
Based on 240 comparable postings.*
* 240 is the maximum number of comparable postings sampled.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
569 open roles
on FindRole.
Listed pay typically runs
$148,300–$224,400
across 536 roles with salary data.
Remote (Usa-Az Tempe Campus Bldg 3-4, US)14 days ago
$106,400–$159,600
CAD
SolidWorks
Pro/E
AutoCAD
ANSYS
MATLAB
Six Sigma
DFSS
GD&T
FDA regulations
ISO standards
GMP
Python
R
SQL
Excel
PowerPoint
Project management
PLM systems