R&D Engineer Physical Design

Broadcom

Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$143,800–$230,000 / yr
Posted
8 days ago
Closes
Dec 6, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $174k
This role $187k
$119k most similar roles pay here $242k

This role pays more than 61% of similar roles. Most pay $139,000–$209,750 — the shaded band above. At the midpoint, this role pays about $187k versus about $174k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 103 open roles on FindRole.

Listed pay typically runs $120,000–$192,000 across 101 roles with salary data.

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At a glance

TL;DR · R&D Engineer Physical Design

Join Broadcom’s Design Implementation team within the ASIC Products Division as a senior physical design engineer, where you will play a pivotal role in developing cutting-edge CMOS ASICs for AI/ML, wireless, networking, computing, and storage applications. Your responsibilities include direct customer communication, integrating various IP blocks such as memories, SerDes, and I/O subsystems, evaluating design trade-offs, addressing timing closure challenges, conducting signal integrity analysis, and managing chip-level planning through tapeout. You will work with advanced technologies like CMOS process nodes and utilize industry-standard tools for physical verification and sign-off. Ideal candidates possess a BS in Electrical Engineering with 12+ years of experience or an MS with 10+ years, along with expertise in ASIC design flows and methodologies.

What you'll do

  • Integrate Broadcom IPs, memories, SerDes, and I/O subsystems into ASIC designs.
  • Evaluate design trade-offs involving power consumption, area utilization, and performance.
  • Address timing closure challenges to ensure signal integrity in chip designs.
  • Perform comprehensive timing analysis for both mission-critical and test modes.
  • Plan, place, and route components at the chip level for efficient physical verification.

What we're looking for

  • BS Degree in Electrical Engineering with 12+ years of relevant experience or MS in Electrical Engineering with 10+ years of relevant work experience.
  • Experience integrating Broadcom IPs, memories, SerDes, and I/O subsystems into complex ASIC designs.
  • Proficiency in evaluating design trade-offs involving power, area, and performance for advanced CMOS ASICs.
  • Expertise in addressing challenges related to timing closure and signal integrity during the physical design phase.
  • Hands-on experience with chip-level planning, place and route, physical verification, and tapeout processes.

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