This role pays less than
54%
of similar roles. Most pay
$142,325–$194,500
— the shaded band above.
At the midpoint, this role pays about
$163k
versus about
$168k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
367 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 367 roles with salary data.
Product Development Engineer – Thermal Engineering will serve as a technical subject matter expert within the advanced packaging and New Product Introduction organization. This role focuses on driving thermal characterization, validation, and technology development for cutting-edge package architectures and next-generation products. The engineer will develop thermal test methodologies, create thermal models to correlate simulation results with laboratory measurements, and perform root-cause analysis to resolve complex thermal issues. Collaborating with cross-functional teams including design, reliability, manufacturing, and test, the individual will support product bring-up, qualification efforts, and manufacturing transfers with OSAT partners. The role requires expertise in heat transfer principles, thermal management techniques, and Thermal Test Vehicles. Candidates should possess strong analytical skills to solve challenges within semiconductor, electronics, or data center environments while contributing to future technology pathfinding and continuous improvement of thermal infrastructure.
Serve as the thermal subject matter expert for advanced packaging and New Product Introduction programs.
Lead thermal characterization activities including test vehicle development, testing, data analysis, and validation.
Develop thermal models and correlate simulation results with laboratory measurements.
Partner with cross-functional teams to assess performance, identify risks, and implement technical solutions.
Support product qualification, bring-up, manufacturing transfers, and production activities with OSAT partners.
Investigate thermal issues, perform root-cause analysis, and drive corrective actions.
Contribute to future technology pathfinding and the improvement of thermal methodologies and infrastructure.
What we're looking for
A Bachelor's degree in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related field is preferred.
An advanced degree in a relevant engineering field is considered a plus.
Experience in thermal engineering within semiconductor, electronics, data center, or advanced packaging environments is preferred.
Strong understanding of heat transfer principles and thermal management techniques is required.
Experience with Thermal Test Vehicles (TTVs), thermal characterization, and laboratory testing is preferred.
Familiarity with thermal modeling, simulation correlation, and data analysis is preferred.
Experience supporting New Product Introduction (NPI), qualification, manufacturing, and OSAT engagements is preferred.
Strong analytical, troubleshooting, communication, and collaboration skills are required.