Principal Signal and Power Integrity Engineer | Microsoft Careers

Microsoft

Quick summary

Work type: On-site
Location: Redmond, WA
Salary: $142,800–$274,800 / yr
Posted: 1 day ago
Closes: Nov 29, 2026

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $186k

This role $209k

$126k most similar roles pay here $291k

This role pays more than 77% of similar roles. Most pay $162,900–$208,800 — the shaded band above. At the midpoint, this role pays about $209k versus about $186k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 598 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 547 roles with salary data.

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TL;DR · Principal Signal and Power Integrity Engineer | Microsoft Careers

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The Signal and Power Integrity Team at Microsoft is seeking a Principal Signal and Power Integrity Engineer to lead the development of cutting-edge custom IP and SoC designs for compute and AI platforms. This role involves implementing end-to-end power delivery strategies from silicon to package, ensuring optimized performance in data center processors and corresponding platforms through detailed design, modeling, and simulation. The engineer will collaborate closely with various teams including thermal architects, motherboard designers, and platform engineers to drive future power delivery solutions for advanced chiplet architectures and packaging technologies. Essential skills include a strong background in power integrity modeling, silicon packaging products development, and experience with foundry silicon and substrate technologies. Ideal candidates possess an MS degree with at least 7 years of relevant industry experience and a deep understanding of the latest trends in system design and architecture.

Skills

PowerIntegrity HPC AdvancedPackaging FoundrySilicon OSATTechnologies SubstrateTechnologies SystemDesign IPDesign ElectricalModelling SIPIDesign CI/CD

What you'll do

Implement end-to-end power delivery designs from silicon to cloud platforms.
Deliver SIPI solutions meeting high-performance computing demands across systems.
Drive future power delivery innovations for chiplet architecture with advanced packaging.
Design and simulate PI models including IP, voltage regulators, and motherboards.
Collaborate on system design decisions involving internal and external stakeholders.
Develop system models based on current and anticipated feature/design needs.

What we're looking for

10+ years of experience in silicon/package/system power integrity/delivery
MSEE or BSEE degree with relevant industry experience
Experience with power integrity modelling for HPC products
Strong foundation in advanced packaging technologies related to power integrity
Knowledge of Foundry Silicon, OSAT, and Substrate technologies
Expertise in end-to-end system SIPI design and architecture

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