High-Speed HBM, LPDDR Memory Controller ASIC Digital Design Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 92% of similar roles. Most pay $169,500–$224,175 — the shaded band above. At the midpoint, this role pays about $144k versus about $197k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 623 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.
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At a glance
Memory Control Design Engineer The Memory Controller Design Team is seeking an ASIC Design Engineer to work on the next generation of high speed DDR Controllers. This role involves the architecture, design, and deployment of memory controllers for LPDDR and PCDDR technologies within products. The engineer will be responsible for developing design specifications, driving micro-architecture for logic design portions, and implementing RTL while collaborating with verification engineers to ensure high quality designs. Key responsibilities include debugging designs during integration, performing synthesis, timing closure, physical design support, gate level simulations, and power analysis. Additionally, the role involves C/C++ modeling of memory controller IP and improving design methodology. The position requires expertise in DDR controller architectures interfacing with CPU, DSP, and multimedia processors, as well as experience with x86 or ARM CPU and bus architectures to enable high speed designs.
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