This role pays less than
60%
of similar roles. Most pay
$173,906–$226,025
— the shaded band above.
At the midpoint, this role pays about
$184k
versus about
$200k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
367 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 367 roles with salary data.
The Failure Analysis Engineering Manager, GPU ASIC and PCBA Debug joins the Quality Engineering team to lead and develop a high-performing team of failure analysis engineers. This role involves overseeing customer and factory investigations for GPU accelerators while driving failure reproduction, isolation, and root cause analysis in collaboration with cross-functional design, validation, firmware, and manufacturing teams. The manager provides technical leadership across power, ASIC, firmware, and thermal domains, utilizing schematics, layouts, and design documentation to guide board-level debug. Key responsibilities include developing triage automation, managing team growth, and presenting findings to stakeholders. Required skills include expertise in GPU ASIC debug, PCBA diagnostics, and hardware verification using oscilloscopes and logic analyzers. Technical proficiency includes Python, shell scripting, and experience with Windows and Linux environments while addressing complex issues in high-speed digital design and data center systems.
Failure Analysis
Post Silicon Validation
PCIe
Memory Validation
Python
Linux
Windows
Firmware
Power Management
Root Cause Analysis
NPI
Oscilloscopes
Logic Analyzers
GPU Architecture
Data Center Infrastructure
AI Tools
GPU
AI/ML
Python
Shell Scripting
Linux
Windows
Firmware
Hardware
Automation
Telemetry
Data Center Infrastructure
Failure Analysis
Validation
Diagnostics
Test Development
Scripting
Orchestration
Physical Failure Analysis
SEM
TEM
Focused Ion Beam
FIB
Electron Microscopy
IC Fabrication
Advanced Packaging
De-processing
Cross-sectioning
Design of Experiments
DOE
Circuit Design
Failure Analysis
Root Cause Analysis
Firmware
BIOS
BMC
IPMI
PCIe
Linux
System Architecture
Signal Integrity
Power Delivery
Networking
AI-assisted Engineering
Automation
Hardware Debugging
Physical Failure Analysis
SEM
TEM
FIB
IC Fabrication
Advanced Packaging
Cross-sectioning
De-layering
Plasma De-processing
Electron Microscopy
Design of Experiments
Root-cause Analysis
Silicon Architecture