Failure Analysis Engineer, Microelectronics

What you'll do

• Perform end-to-end root cause failure analysis on microelectronic components in manufacturing, test, and field environments.
• Conduct advanced electrical fault isolation using techniques like TDR, RF characterization, and nanoprobing to locate defects.
• Execute physical failure analysis using SEM, FIB, EDS, and cross-sectioning to identify mechanisms in silicon and packaging.
• Apply physics-of-failure principles to determine root causes such as electromigration, thermal fatigue, and delamination.
• Drive corrective actions by collaborating with design and manufacturing teams to implement validated process changes.
• Author detailed technical reports documenting failure modes, root cause conclusions, and the effectiveness of corrective actions.
• Develop and improve failure analysis techniques and workflows for new packaging technologies and materials.

What we're looking for

• Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or another STEM discipline.
• 2+ years of hands-on experience in microelectronics failure analysis or materials characterization.
• Must be a U.S. citizen, national, lawful permanent resident, refugee, or asylee to meet ITAR requirements.
• Master's or PhD in a relevant STEM field with a focus on microelectronics or failure analysis (preferred).
• Experience with advanced FA tools such as SEM, FIB, EDS, and cross-sectioning (preferred).
• Proficiency in electrical characterization and fault isolation techniques like IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, or nanoprobing (preferred).
• Knowledge of semiconductor physics, failure mechanisms, JEDEC/AEC standards, and physics-of-failure methodologies (preferred).
• Experience analyzing complex datasets with Python, JMP, or similar tools (preferred).