CMP Module Process Engineer IV

Applied Materials

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Quick summary

Work type
On-site
Location
Phoenix, AZBoise, IDDallas, TXSanta Clara, CAHillsboro, OR
Salary
$116,000–$159,500 / yr
Employment
Full-time
Posted
55 days ago
Freshness
Confirmed live today

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $192k
This role $138k
$103k $238k
below market most similar roles pay here above market

This role pays less than 87% of similar roles. Most pay $160,947–$223,000 — the blue band above. At the midpoint, this role pays about $138k versus about $192k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · CMP Module Process Engineer IV

CMP Module Process Engineer IV - (E4) joins the team as a technical expert in Chemical Mechanical Planarization (CMP) processes within a Wafer Fab environment. The role involves identifying and troubleshooting complex CMP process, yield, and integration problems using data analytics. Key responsibilities include leading customer discussions to address High Value Problems, proposing Continuous Improvement Projects, and optimizing process Cpk, matching, and output. The engineer will drive the adoption of new service technologies like FabVantage offerings through demos and joint development programs. Required skills include advanced integration knowledge across four or more processes on two or more technologies. The position utilizes systematic troubleshooting methodologies, BOM, EC, FSS data, and FV360 to provide root cause diagnostics and present technical reports to customers to reduce defects and variability.

What you'll do

  • Perform data analytics to identify, troubleshoot, and solve complex CMP process, yield, and integration problems.
  • Lead customer discussions to identify high-value problems and implement continuous improvement projects.
  • Optimize process Cpk, matching, and output to reduce defects, variability, and cost of ownership.
  • Drive the adoption of new service technologies through demos, on-site evaluations, and joint development programs.
  • Resolve complex tool issues using systematic troubleshooting methodologies for effective root cause diagnostics.
  • Issue and present technical reports to customers based on BOM, EC, FSS data, and FV360 metrics.
  • Mentor junior MPEs and contribute to the CMP network of experts and Community of Practice.

What we're looking for

  • Must have a BS in Engineering.
  • Must have 10+ years of experience in Chemical Mechanical Planarization (CMP) Process.
  • Must have a strong Wafer Fab and equipment experience background.
  • Must have a data analytics background for identifying and troubleshooting complex CMP Process, Yield, and Integration problems.
  • Must be a technical expert in CMP Unit Process and Wafer Fab operations.
  • Must have domain knowledge of 4 or more processes on 2 or more technologies.
  • Must be able to communicate complex ideas and persuade others at senior levels to adopt different points of view.
  • Must be able to travel up to 20% of the time.

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