Careers
Quick summary
- Work type
- On-site
- Location
- San Diego, CA
- Posted
- 37 days ago
- Nearby
- 99+ roles within 25 mi
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Salary context
How this pay compares to similar roles
This listing doesn't post a salary. Most similar roles pay $152,075–$208,800.
Based on 239 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 660 open roles on FindRole.
Listed pay typically runs $154,000–$231,000 across 429 roles with salary data.
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At a glance
TL;DR · Careers
The CHS-AAD team at Qualcomm’s Central Hardware Systems division seeks an experienced individual contributor engineer to join their cutting-edge technology work. As a senior member, you will collaborate with cross-functional teams including technology, product management, and chipset groups to design high-performance XR packages based on Snapdragon SoCs. Your daily tasks include IC floorplanning, system-level co-design methodologies, package selection analysis, PDN implementation, and verification using tools like ORCAD and Allegro. You will also engage in competitive analysis and roadmapping for future products. The ideal candidate has a master’s degree in Electrical or Computer Engineering with 7+ years of experience in high-speed package/SIP/PCB design, expertise in SIPI, PDN, thermal management, and compliance testing, along with hands-on experience in PCIe, DDR, Ethernet, SerDes, and communication protocols.
What you'll do
- Develop high-performance package/SIP designs for XR products.
- Implement system level co-design methodology for IC, Package, and PCB/Board integration.
- Analyze new product requirements to select optimal packages based on mechanical, thermal, and electrical criteria.
- Design power distribution networks (PDN) for high-speed processor cores to meet performance targets.
- Verify package and SIP designs using Valor and ravel checks to ensure quality.
- Collaborate with suppliers and Osats on design reviews to optimize cost and area efficiency.
What we're looking for
- 7+ years of experience in package/SIP/PCB hardware design.
- Expertise in designing high-speed, dense, multi-layer packages and systems.
- Proficiency in logic design, schematic capture tools, board layout, and testing.
- Strong knowledge of SIPI, PDN, thermal management, and compliance testing.
- Hands-on experience with PCIe, DDR, Ethernet, SerDes, and communication protocols.
- Master's degree in Electrical or Computer Engineering or related field required.
- Bachelor's degree and 9+ years of Systems Engineering experience acceptable alternative.
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