Product Thermal Test Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 95% of similar roles. Most pay $152,800–$235,750 — the shaded band above. At the midpoint, this role pays about $118k versus about $194k for comparable roles.
Based on 239 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 623 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.
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At a glance
The #Agentic AI Windows Power and Thermal Engineer joins the Power/Thermal Software products team to develop industry-leading management solutions for Compute, Mobile, IoT, Automotive, and AR/VR chipsets. Working with cross-functional teams, you will profile power and thermal usage, identify peak current risks, and provide optimized mitigation solutions through system-level analysis. A primary focus involves building end-to-end infrastructure automation using Agentic AI to process massive telemetry data including power, performance, and logs. You will design, train, and deploy neural network architectures such as CNNs, LLMs, or Transformers while developing competitive analysis tools. The role requires expertise in machine learning, cloud computing, and SoC hardware blocks. Key technical skills include experience with operating systems, JTAG debuggers, oscilloscopes, logic analyzers, and deep knowledge of embedded systems, microcontrollers, and wireless communications to optimize power and performance.
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