Agentic AI Windows Power and Thermal Engineer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$99,500–$149,300 / yr
Posted
40 days ago
Freshness
Confirmed live yesterday
Closes
Mar 16, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $204k
This role $124k
$82k $264k
below market most similar roles pay here above market

This role pays less than 92% of similar roles. Most pay $162,000–$246,150 — the blue band above. At the midpoint, this role pays about $124k versus about $204k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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At a glance

TL;DR · Agentic AI Windows Power and Thermal Engineer

The #Agentic AI Windows Power and Thermal Engineer joins the Power/Thermal Software products team to develop industry-leading management solutions for Compute, Mobile, IoT, Automotive, and AR/VR chipsets. The role involves profiling power and thermal risks, performing system-level analysis, and collaborating with architecture and hardware teams to provide optimized mitigations. Key responsibilities include building end-to-end infrastructure automation to process telemetry data, designing and deploying neural network architectures like CNNs, LLMs, and Transformers, and developing competitive analysis methodologies. Required skills include expertise in AI model development, data pipeline management, and operating system concepts like scheduling and memory management. Candidates must utilize tools such as JTAG debuggers, oscilloscopes, and logic analyzers while applying knowledge of microprocessor architecture, SoC power, and embedded systems to solve complex thermal management problems.

What you'll do

  • Profile power and thermal metrics to identify peak current risks and provide optimized mitigation solutions.
  • Perform system-level analysis of power and thermal use cases across various chipsets.
  • Design, train, and deploy neural network architectures like CNNs, LLMs, or Transformers for automation.
  • Build end-to-end infrastructure automation to process large telemetry data including power, performance, and logs.
  • Develop tools and methodologies for competitive analysis to identify industry-leading thermal mitigation schemes.
  • Collaborate with hardware and software teams to implement optimal system-level power and thermal software solutions.

What we're looking for

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or a related field.
  • Systems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (preferred).
  • AI expertise in model development, data pipeline management, and infrastructure automation (preferred).
  • Knowledge of operating systems concepts including scheduling, memory management, and device drivers (preferred).
  • Proficiency using debug tools like JTAG debuggers, oscilloscopes, and logic analyzers (preferred).
  • Knowledge of mobile power or power/thermal management software development (preferred).
  • In-depth knowledge of embedded systems, microcontrollers, SoC power, modem, multimedia, and wireless communications (preferred).
  • Experience with system-level debugging and analysis for SoC power optimizations (preferred).

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