Product Thermal Test Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 92% of similar roles. Most pay $162,000–$246,150 — the blue band above. At the midpoint, this role pays about $124k versus about $204k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
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At a glance
The #Agentic AI Windows Power and Thermal Engineer joins the Power/Thermal Software products team to develop industry-leading management solutions for Compute, Mobile, IoT, Automotive, and AR/VR chipsets. The role involves profiling power and thermal risks, performing system-level analysis, and collaborating with architecture and hardware teams to provide optimized mitigations. Key responsibilities include building end-to-end infrastructure automation to process telemetry data, designing and deploying neural network architectures like CNNs, LLMs, and Transformers, and developing competitive analysis methodologies. Required skills include expertise in AI model development, data pipeline management, and operating system concepts like scheduling and memory management. Candidates must utilize tools such as JTAG debuggers, oscilloscopes, and logic analyzers while applying knowledge of microprocessor architecture, SoC power, and embedded systems to solve complex thermal management problems.
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