Agentic AI Windows Power and Thermal Engineer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$94,200–$141,200 / yr
Posted
59 days ago
Freshness
Confirmed live yesterday
Closes
Jan 10, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $194k
This role $118k
$77k most similar roles pay here $253k

This role pays less than 95% of similar roles. Most pay $152,800–$235,750 — the shaded band above. At the midpoint, this role pays about $118k versus about $194k for comparable roles.

Based on 239 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Agentic AI Windows Power and Thermal Engineer

The #Agentic AI Windows Power and Thermal Engineer joins the Power/Thermal Software products team to develop industry-leading management solutions for Compute, Mobile, IoT, Automotive, and AR/VR chipsets. Working with cross-functional teams, you will profile power and thermal usage, identify peak current risks, and provide optimized mitigation solutions through system-level analysis. A primary focus involves building end-to-end infrastructure automation using Agentic AI to process massive telemetry data including power, performance, and logs. You will design, train, and deploy neural network architectures such as CNNs, LLMs, or Transformers while developing competitive analysis tools. The role requires expertise in machine learning, cloud computing, and SoC hardware blocks. Key technical skills include experience with operating systems, JTAG debuggers, oscilloscopes, logic analyzers, and deep knowledge of embedded systems, microcontrollers, and wireless communications to optimize power and performance.

What you'll do

  • Profile power and thermal usage to identify risks regarding peak current and system performance.
  • Develop optimized software solutions to mitigate identified power and thermal issues across various chipsets.
  • Perform system-level analysis of power and thermal use cases in collaboration with hardware and software teams.
  • Design, train, and deploy neural network architectures like CNNs, LLMs, or Transformers for automation.
  • Build end-to-end infrastructure to process large telemetry data sets including power, performance, and logs.
  • Develop tools and methodologies to conduct competitive analysis of industry thermal mitigation schemes.
  • Implement automated systems using AI/Agentic AI infrastructure to optimize system performance.

What we're looking for

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or a related field.
  • Experience with systems and hardware including microprocessor architecture and common SoC hardware blocks.
  • Expertise in AI model development, data pipeline management, and infrastructure automation.
  • Knowledge of operating system concepts such as scheduling, memory management, and device drivers.
  • Proficiency using debug tools like JTAG debuggers, oscilloscopes, and logic analyzers.
  • Experience in mobile power or power/thermal management software development.
  • In-depth knowledge of embedded systems, microcontrollers, SoC power, modem, multimedia, and wireless communications.
  • Ability to perform system-level debugging and analysis for SoC power optimizations.

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