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Process Engineer, Die to Wafer Hybrid Bonding

Applied Materials

Santa Clara, CA 71 days ago
Actively hiring Confirmed live yesterday High trust
die‑to‑wafer hybrid bonding 2.5D/3D Integration Plasma Activation DOE SPC JMP Failure Analysis Surface Preparation Die Thinning Planarization Heterogeneous Integration III-V to Si Micro-LED CPO Overlay Wet Clean
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Process Engineer, Die to Wafer Hybrid Bonding

Applied Materials

Santa Clara, CA 92 days ago $147,000–$202,500
Actively hiring Confirmed live yesterday Trusted Below market
Die to Wafer Hybrid Bonding 2.5D/3D Advanced Packaging Semiconductor Manufacturing Plasma Activation DOE SPC JMP Failure Analysis Surface Preparation Die Thinning Planarization Heterogeneous Integration Micro-LED CPO III-V to Si Overlay Wet Clean
Save