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Active Keyword: Packaging Engineer Remove filter Location: San Francisco Remove filter Clear all

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Packaging Engineer

Apple Inc

San Francisco, CA 63 days ago $184,700–$324,800
Actively hiring Confirmed live yesterday High trust Above market
IC Packaging Wafer Level Chip Scale Packaging WLP Wafer Bumping RDL BEOL Assembly Fan-In Fan-Out AutoCAD Multi-physics Simulation Wafer Back-grind Wafer Dicing Flip Chip Die Attach Encapsulation Molding Under-fill Ball Attach Package Singulation Tape & Reel Reliability Testing
10+ yrs exp
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IC Packaging Integration Engineer

Apple Inc

San Francisco, CA 95 days ago $184,700–$324,800
Actively hiring Confirmed live yesterday Low trust Above market
Semiconductor Packaging Design SiP Packaging Cadence APD Allegro Signal Integrity Power Integrity Design for Manufacturing NPI Package Layout Si Floor Plan Process & Technology Development reliability, testing BOM HVM
10+ yrs exp
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