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Active Keyword: Advanced Packaging Director Remove filter Location: Austin Remove filter Clear all

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Director, Advanced Packaging (Panel-Scale Technologies)

Amd

Austin, TX 1 day ago $186,000–$279,000
Actively hiring Confirmed live today Posted today High trust Competitive pay
Advanced Packaging Semiconductor Technology 3D Packaging Panel-Level Fan-Out RDL Interposers Die Bonding Thermocompression Bonding (TCB) Hybrid Bonding Design for Manufacturing (DFM) Design for Yield (DFY) Wafer-Level Assembly Mass Reflow Molding Wafer Thinning Signal Integrity Power Delivery
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Director, Advanced Packaging Disruptive Technology

Applied Materials

Singapore, Singapore +5 127 days ago
Actively hiring Confirmed live today High trust
Advanced Packaging Heterogeneous Integration Chiplet Ecosystems D2W RDL CoWoS TSV Semiconductor Technology Materials Science Electrical Engineering Mechanical Engineering Physics R&D System Architecture HPC AI
10+ yrs exp
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