This role pays more than
83%
of similar roles. Most pay
$148,500–$209,750
— the shaded band above.
At the midpoint, this role pays about
$226k
versus about
$179k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
750 open roles
on FindRole.
Listed pay typically runs
$154,000–$231,000
across 430 roles with salary data.
As an experienced Thermal Engineer at Qualcomm Technologies, Inc., you will join a dynamic platform team focused on developing high-performance servers and collaborating with cross-functional teams including packaging, electrical, mechanical, and component suppliers. Your day-to-day responsibilities include conducting thermal testing, characterization, and validation of server hardware such as heat sinks, cold plates, air cooling systems, and liquid cooling solutions, while also supporting thermal modeling and simulation efforts to enhance product performance and reliability. You will leverage your expertise in heat transfer fundamentals and hands-on experience with thermal testing equipment to validate and improve thermal models, contributing to the development of robust thermal solutions for high-performance computing systems. Essential skills include proficiency in thermal interface materials (TIMs), familiarity with thermal challenges related to package design and silicon architecture, and some experience with thermal simulation tools like Celsius EC, Flotherm, or Icepak. Additionally, you will work on data center-specific thermal challenges such as rack-level cooling and airflow management, requiring strong communication skills for technical documentation and presentations to stakeholders.
Thermal simulation
PC thermal systems
System design
Silicon design
SW development
Matrixed organization
Executive communication
Methodology development
Tool development
Performance tuning
Customer interaction
Negotiation skills
Influence management
Long-term planning
Complex information communication
CPU
SoC
Datacenter Server
Mobile Compute
Auto SoCs
Boot Architecture
APCI
PSCI
Dynamic Voltage and Frequency Scaling
Analog Mixed Signals IPs
Over-Current Protection
Power Management
Thermal Management
Software Control Loops
Firmware Control Loops
High-Level Architecture Specification
RTL Design