Lead ASIC Design Engineer
Amazon Inc
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How this pay compares to similar roles
This role pays more than 77% of similar roles. Most pay $152,000–$187,250 — the shaded band above. At the midpoint, this role pays about $187k versus about $170k for comparable roles.
Based on 240 similar postings.
Employer
Amazon Inc. is the world''s largest e-commerce and cloud computing company, operating the Amazon marketplace, AWS cloud platform, Prime subscription services, Alexa voice AI, and logistics infrastructure. Industry: E-Commerce & Cloud Computing
Amazon Inc currently has 321 open roles on FindRole.
Listed pay typically runs $143,700–$194,400 across 304 roles with salary data.
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At a glance
As a Senior FPGA Modem and Physical Layer Development Engineer at Amazon Leo, you will join the cutting-edge hardware development team to design high-performance FPGA solutions for next-generation modem systems from Low Earth Orbit (LEO) satellites. Your primary responsibilities include end-to-end RTL development, system integration with digital communications and RF teams, cross-functional collaboration across HW, FW, and SW domains, architectural trade-offs optimization, and lab-based silicon validation using advanced signal generators and analyzers. You will work extensively with System Verilog/Verilog/VHDL on Xilinx/AMD or Intel/Altera FPGAs to create ultra-reliable low-latency, high-throughput physical layer solutions for 5G systems.
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