SOC Thermal Engineer

Apple Inc

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Work type
On-site
Location
Austin, TX
Posted
2 days ago
Freshness
Confirmed live today

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How this pay compares to similar roles

Similar $205k
$139k $277k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $176,025–$233,850.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3546 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2746 roles with salary data.

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At a glance

TL;DR · SOC Thermal Engineer

The SOC Thermal Engineer will join a multi-functional team to optimize mobile device thermal performance and participate in advanced IC packaging research and development. The role involves designing and validating cooling solutions for high-performance computing systems, specifically addressing chip energy efficiency and performance scaling. Day-to-day responsibilities include providing thermal modeling solutions for mobile devices at silicon die and semiconductor package levels, analyzing simulation and measurement results, and integrating cooling solutions into next-generation SOC architecture designs. Candidates must possess expertise in IC physical design parameters, low-power design techniques, and advanced packaging assembly processes. Required technical skills include proficiency with industry-standard tools such as Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk to perform thermal analysis, testing, and validation for high-power SoCs.

What you'll do

  • Design and validate cooling solutions for high-performance computing systems.
  • Perform thermal analysis and design solutions to improve chip energy efficiency and performance scaling.
  • Provide thermal modeling solutions for mobile devices at the silicon die and semiconductor package levels.
  • Analyze simulation and measurement results to enhance product thermal management.
  • Integrate cooling solutions into next-generation SoC architecture designs.
  • Execute experimental test setups and analyze resulting thermal data.
  • Validate thermal performance and reliability across various product lines.

What we're looking for

  • Bachelor's degree required.
  • Demonstrated leadership capabilities at the senior engineer level (preferred).
  • Deep expertise in thermal design for silicon devices and packaging solutions (preferred).
  • Proven experience with IC physical design parameters and their impact on electrical and thermal performance (preferred).
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches (preferred).
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics (preferred).
  • Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs (preferred).
  • Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk (preferred).

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