IC Package Mechanical FEA Engineer (R&D)
Broadcom
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How this pay compares to similar roles
This role pays more than 86% of similar roles. Most pay $134,437–$198,200 — the shaded band above. At the midpoint, this role pays about $226k versus about $166k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 558 open roles on FindRole.
Listed pay typically runs $154,000–$231,000 across 401 roles with salary data.
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At a glance
Qualcomm Technologies is hiring a Staff or Senior Staff Server FEA Engineer to lead structural simulation and system-level modeling for high-performance server platforms, ensuring mechanical robustness and reliability from package through in-rack deployment. This role involves leading multi-scale finite element analysis across various levels, correlating analytical models with test data, and driving platform-level design decisions based on simulation results. The ideal candidate will have a strong background in structural mechanics and dynamics, extensive experience with ANSYS or similar tools, and the ability to communicate technical analyses effectively to cross-functional teams. This position requires expertise in rack-scale modeling and multi-physics coupling, as well as an understanding of OCP product designs and industry standards.
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