Senior Quantum Package & Motherboard Engineer | Microsoft Careers

Microsoft

Quick summary

Work type
On-site
Location
Redmond, WA
Salary
$119,800–$234,700 / yr
Posted
2 days ago
Closes
Dec 10, 2026
Nearby
99+ roles within 25 mi

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $188k
This role $177k
$106k most similar roles pay here $248k

This role pays more than 58% of similar roles. Most pay $163,165–$213,375 — the shaded band above. At the midpoint, this role pays about $177k versus about $188k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 1568 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 1397 roles with salary data.

Most-posted roles

View all roles at Microsoft

At a glance

TL;DR · Senior Quantum Package & Motherboard Engineer | Microsoft Careers

Apply Now Log in to save

As a Senior Quantum Package & Motherboard Engineer, you will join a dynamic team of engineers and scientists to adapt packaging and motherboard design processes for cryogenic quantum devices. Your daily responsibilities include collaborating with cross-functional teams such as architecture, verification, analog, physical design, and vendors to ensure the successful implementation and verification of complex quantum hardware. You will develop robust design processes, drive external material vendors, and simulate components for signal and power integrity. Additionally, you will manage electrical and PCB development workflows, mentor junior engineers, and leverage AI tools to enhance efficiency in layout execution times. The role requires expertise in analog signal, power integrity, and signal integrity simulations, proficiency with industry-standard tools like Cadence Allegro and Mentor Graphics, and experience working at cryogenic temperatures. This position is crucial for scaling topological qubits and quantum systems that unlock significant scientific and business value.

Skills

AI Python Signal Integrity Power Integrity PCB Design Package Design Cryo Temperatures Analog Layout Electronics Manufacturing Services Contract Manufacturers Simulation Tools Documentation Tools Manufacturing Readiness Processes Dashboards Reporting Mechanisms

What you'll do

  • Develop and maintain robust packaging and motherboard design processes for quantum devices.
  • Design and drive external material vendors to deliver solutions for quantum device packaging.
  • Simulate packaging/motherboard components for signal and power integrity.
  • Own signaling chain specifications from room temperature to cryogenic logic temperatures.
  • Improve electrical and PCB development processes, documentation, and validation workflows.
  • Communicate engineering input into decision frameworks across technical and executive audiences.
  • Mentor junior engineers while reinforcing inclusive culture and values.

What we're looking for

  • 10+ years of experience in Silicon Package Design and PCB Design.
  • Successfully delivered Silicon Packages and Motherboards into production.
  • Proficient in industry-standard tools for Package and PCB Design.
  • Expertise in Analog Signal, Power Integrity & Signal Integrity simulations.
  • Experience with cryogenic temperatures in Package, Motherboard designs.
  • Ability to leverage AI for innovation and efficiency in design processes.
  • Strong interpersonal skills and experience working with external partners.

Related searches

More Senior Quantum Package & Motherboard Engineer jobs Senior Quantum Package & Motherboard Engineer jobs in Redmond All jobs at Microsoft

More like this

Similar roles

Senior Quantum Engineer - Cryo-CMOS Analog Circuit Design | Microsoft Careers

Microsoft

WA +2 27 days ago $119,800–$234,700
Cadence_Virtuoso Python Linux Verilog SystemVerilog Analog-to-Digital_Converters Digital-to-Analog_Converters Phase-Locked_Loops RF_Components Cryogenic_Circuit_Design Low_Temperature_Measurements Semiconductor_Behavior ASIC_Bring-Up Characterization Signal_Integrity Documentation
Save