This role pays more than
59%
of similar roles. Most pay
$154,768–$201,524
— the shaded band above.
At the midpoint, this role pays about
$180k
versus about
$178k
for comparable roles.
Based on 240 similar postings.
Employer
About General Dynamics
General Dynamics is a global aerospace and defense company offering a broad portfolio of products and services in business aviation, ship construction, land combat vehicles, and information technology. It serves customers in the U.S. government, allied governments, and a diverse array of commercial markets.
General Dynamics currently has
1123 open roles
on FindRole.
Listed pay typically runs
$124,093–$150,385
across 984 roles with salary data.
As a Senior Photonics Engineer, you will join the engineering team to lead photonic design execution across multiple programs and technology platforms. You will manage the full photonic integrated circuit lifecycle, including requirements analysis, component design, simulation, layout, foundry tape-out, and post-fabrication testing. Your daily work involves designing PIC circuits using foundry PDKs, performing simulations with tools like Lumerical or Tidy3D, and executing layouts in Luceda IPKISS. You will also lead characterization activities for optical and electrical measurements while mentoring junior engineers. The role requires expertise in silicon, silicon nitride, or lithium niobate platforms and knowledge of components like waveguides and modulators. You will solve complex challenges in optical communication systems and integrated photonic circuits to support mission-critical defense and intelligence applications through advanced hardware development and system-level design.
Lead the full PIC design cycle including requirements analysis, simulation, layout, tape-out, and post-fabrication testing.
Design photonic integrated circuit components and circuits using foundry PDKs and first-principles approaches.
Execute PIC layouts using Luceda IPKISS or equivalent tools.
Perform photonic simulations using Lumerical, Tidy3D, Photonforge, or similar software.
Manage tape-out processes with domestic foundries including design rule checks and run coordination.
Lead testing and characterization of fabricated devices through optical and electrical measurements on bare die and packaged parts.
Design PICs with packaging constraints such as fiber coupling, electrical fanout, thermal, and mechanical requirements in mind.
Contribute to optical system-level design, trade studies, technical proposals, and customer-facing design reviews.
What we're looking for
U.S. citizenship is required.
Ability to obtain a Department of Defense TS/SCI security clearance is required.
Bachelor's degree in Electrical Engineering or a related field with 8+ years of experience, or a Master's degree with 6+ years of experience.
Experience with full-lifecycle PIC design including modeling, tape-out, and testing.
Proficiency with PIC layout tools like Luceda IPKISS or Photonforge and simulation tools like Lumerical or Tidy3D.
Experience with foundry tape-out at a commercial photonics foundry.
Working knowledge of core PIC building blocks such as waveguides, couplers, ring resonators, and modulators.
Python or scripting for design automation or test (preferred); multi-platform experience across silicon, silicon nitride, or lithium niobate (preferred).