Principal Thermal Engineer

Oracle

Actively hiring
United States Posted 22 days ago $109,200$223,400 / year

At a glance

AI generated

TL;DR

We are seeking a Principal Thermal Engineer to lead the deployment and management of direct-to-chip liquid cooling technology with external manufacturing partners. This individual contributor role involves ensuring robust technical implementation, driving quality standards, and overseeing supplier collaboration while supporting the innovation of advanced thermal management solutions. Key responsibilities include developing technical specifications, qualifying and integrating systems at manufacturing sites, reviewing engineering designs for alignment with system-level requirements, auditing supplier processes, and providing continuous improvement based on field data. The ideal candidate has a Bachelor’s or Master’s degree in Mechanical Engineering or related fields, 5+ years of experience in thermal systems engineering, hands-on experience with liquid cooling technologies, and expertise in manufacturing processes and technology transfer. Familiarity with industry standards such as ASHRAE and OCP is essential for this role focused on high-performance computing and data center applications.

Skills

Direct-to-chip_liquid_cooling Cold_plate_cooling ASHRAE OCP RoHS Manufacturing_processes Supplier_management Technical_troubleshooting Process_audit Industry_standards Environmental_compliance Coolant_chemistries Test_plans Validation_results Process_control_documents Technical_reports CI/CD

What you'll do

  • Develop and maintain technical specifications for direct-to-chip cooling solutions.
  • Oversee qualification and mass production of liquid cooling systems at external sites.
  • Drive problem-solving efforts on yield, performance, and manufacturing challenges.
  • Review and validate engineering designs to ensure alignment with system requirements.
  • Audit supplier manufacturing processes for compliance with company standards.
  • Support continuous improvement of cooling designs based on field data feedback.
  • Provide technical training and guidance to manufacturing partners as needed.

What we're looking for

  • At least 5 years of experience in thermal systems engineering with focus on liquid cooling.
  • Hands-on experience in manufacturing processes and supplier management for technology transfer.
  • Strong understanding of reliability, safety, and performance challenges specific to liquid cooling.
  • Demonstrated ability to develop and maintain technical specifications for direct-to-chip cooling solutions.
  • Experience in auditing supplier manufacturing processes for compliance with industry regulations.
  • Excellent verbal and written communication skills for diverse audiences.
  • Familiarity with industry standards such as ASHRAE, OCP, RoHS for data center cooling.

Market check

Salary context

This $109,200–$223,400 range sits above 39% of similar postings on FindRole.

Peer median band

$139,900$230,000

Median floor and ceiling across peers.

Typical midpoint (25–75%)

$149,887$219,750

Middle half of comparable postings.

Based on 238 comparable postings.

* 240 is the maximum number of comparable postings sampled.

Employer

About Oracle

Oracle Corporation is a leading multinational technology company specializing in database software, cloud computing, and enterprise software.

Oracle currently has 251 open roles on FindRole.

Listed pay typically runs $97,500–$199,500 across 193 roles with salary data.

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