Principal CPU Architect, High-Performance and Physical Design

Nvidia

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Santa Clara, CAAustin, TXHillsboro, OR
Salary
$272,000–$431,250 / yr
Employment
Full-time
Posted
43 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $220k
This role $352k
$134k most similar roles pay here $463k

This role pays more than 98% of similar roles. Most pay $184,900–$254,750 — the shaded band above. At the midpoint, this role pays about $352k versus about $220k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 1047 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 833 roles with salary data.

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At a glance

TL;DR · Principal CPU Architect, High-Performance and Physical Design

As a Principal CPU Architect - High-Performance and Physical Design, you will join the CPU architecture team to bridge the gap between architectural decisions, RTL implementation, and physical design for high-frequency server-class processors. You will serve as a subject matter expert on power delivery, regulators, power gating, di/dt, and thermal throttling while analyzing trade-offs for die stacking and packaging proposals. Your daily work involves driving improvements in high-frequency design and power methodology for custom CPU cores. The role requires deep expertise in microarchitectural decisions, standard-cell and circuit-level tradeoffs, process technology, and advanced packaging techniques. You must possess a strong understanding of power dissipation, delivery, and efficiency across the stack from software to VLSI. This position focuses on solving complex challenges in high-performance computing by optimizing performance-per-watt for server-class CPU architectures.

What you'll do

  • Bridge the gap between architecture, RTL implementation, and physical design.
  • Serve as a subject matter expert on power delivery, regulators, power gating, di/dt, and thermal throttling.
  • Analyze power trade-offs for various die stacking and packaging proposals.
  • Propose and drive improvements for power and power methodology for custom CPU cores.
  • Implement low power techniques across the stack from software to architecture, RTL, VLSI, and process.
  • Drive the development of CPU technology for AI, HPC, and cloud service provider workloads.

What we're looking for

  • BS/MS in Electrical Engineering, Computer Science, Computer Engineering, or equivalent experience.
  • 15 or more years of relevant experience.
  • Extensive background in CPU architecture and high-frequency server CPU design.
  • Solid understanding of power dissipation, delivery, and efficiency concepts.
  • Detailed understanding of process technologies and circuit design.
  • Knowledge of tradeoffs related to advanced packaging techniques.
  • Well versed in power management techniques spanning SW, Architecture, RTL, VLSI, and process.
  • PhD or research experience (preferred); advanced knowledge in physical design; knowledge of GPU and SoC design (preferred).

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