Qualcomm Technologies is hiring a Principal Chipset Project Engineer for Hardware PCB/Platform Systems in the Personal Compute (PC) segment to lead platform and PCB strategy across their entire compute portfolio. This senior role involves defining hardware architecture, driving cost-optimized system decisions, enabling scalable solutions, and engaging with vendors, OEMs, and ODMs to ensure competitive PC platforms. The engineer will collaborate closely with Product Management, engineering leads, and other teams to meet aggressive targets for cost, area, power, and performance. Key responsibilities include leading architectural trade-offs, setting PCB cost targets, driving competitiveness through efficient design practices, and establishing best practices for platform architecture. Ideal candidates have over 12 years of experience in PC hardware platform architecture and PCB design, with expertise in PDN, SI/PI, and strong communication skills to influence cross-functional teams effectively.
Skills
PCB
PDN
SI
PI
Kubernetes
Docker
CI/CD
AWS
Python
PostgreSQL
Git
JIRA
Confluence
Terraform
Prometheus
Grafana
What you'll do
Lead early PCB architectural decisions to optimize cost, power, performance, and risk implications.
Set and execute targets for PCB cost, area, and bill of materials while maintaining best-in-class system performance.
Drive competitiveness in platform design by minimizing layer count, stack-up, board area, and routing inefficiencies.
Establish partnerships across chipset systems, product management, packaging, and customer engineering to ensure coherent execution.
Engage with vendors, OEMs, and ODMs to enable manufacturable, cost-effective PC designs aligned with early architecture.
Develop best practices for cost-driven platform and PCB architecture to support repeatable, scalable execution.
What we're looking for
12+ years of experience in hardware platform architecture and PCB design for personal computers.
Strong understanding of PCB fundamentals including layer drivers, stack-up trade-offs, routing density, and cost impacts.
Proven expertise in power delivery networks (PDN), signal integrity (SI), and power integrity (PI).
Track record of making early architectural decisions impacting platform cost, complexity, manufacturability, and scalability.
Ability to articulate PCB design choices and their impact on cost, power, performance, and manufacturability.
Demonstrated leadership in leading and influencing cross-functional teams across the organization.
Strong communication skills for interfacing with senior executives, customers, and cross-functional leadership.
Market check
Salary context
This
$192,600–$289,000
range sits above
83%
of similar postings on FindRole.
Peer median band
$162,600–$241,500
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$173,812–$235,750
Middle half of comparable postings.
Based on 240 comparable postings.*
* 240 is the maximum number of comparable postings sampled.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
565 open roles
on FindRole.
Listed pay typically runs
$148,300–$226,100
across 532 roles with salary data.
Thermal simulation
PC thermal systems
System design
Silicon design
SW development
Matrixed organization
Executive communication
Methodology development
Tool development
Performance tuning
Customer interaction
Negotiation skills
Influence management
Long-term planning
Complex information communication
Remote (Usa-San Jose, US)32 days ago
$191,400–$281,400
HFSS
ADS
MATLAB
Cadence PowerSI/DC
Allegro
Simbeor
HSpice
ICAT
Seasim
Power Integrity simulation tools
3-D field solvers
VNA
TDR
Scopes
Transmission line theory
Channel modeling
Signal integrity concepts
Electromagnetic theory
Coupling mechanisms
High-speed DDR links
NRZ and PAM4 SerDes
PCB development
PI analysis