Micro-electronics Technician

Anduril Industries

Quick summary

Work type
On-site
Location
Lexington, MA
Posted
2 days ago

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How this pay compares to similar roles

Similar $174k
$128k most similar roles pay here $211k

This listing doesn't post a salary. Most similar roles pay $146,000–$202,700.

Based on 240 similar postings.

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About Anduril Industries

Anduril Industries is a defense technology company that builds advanced hardware and software systems for national security, including autonomous drones, surveillance systems, and the Lattice AI command platform.

Anduril Industries currently has 1993 open roles on FindRole.

Listed pay typically runs $146,000–$194,000 across 1806 roles with salary data.

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At a glance

TL;DR · Micro-electronics Technician

Join the Anduril Imaging team as a Wire Bonding Technician, where you will work in a clean room environment to package and test custom infrared image sensors. Your daily tasks include handling silicon wafers, wire bonding image sensors into ceramic packages, conducting visual and electrical inspections of sensor chip assemblies, and operating custom test equipment to collect image data. Ideal candidates have 5+ years of experience with precision test and measurement equipment in a clean room setting, along with expertise in microelectronics packaging and automated tools like SolidWorks and scripting languages such as MATLAB or Python. This role demands meticulous attention to detail and proficiency in handling delicate hardware for innovative imaging solutions at scale.

What you'll do

  • Package, test, and wire bond custom infrared image sensors in a clean room.
  • Handle silicon wafers for automated probe testing and inspection.
  • Wire bond image sensors into ceramic packages using precise motor skills.
  • Conduct visual and electrical inspections of sensor chip assemblies post-packaging.
  • Operate custom test equipment to collect image data from sensor chip assemblies.

What we're looking for

  • 5+ years experience with precision test and measurement equipment for hardware development or production.
  • Experience in collecting data from devices under test using inspection and testing equipment.
  • Proficiency in working within a clean room environment, handling delicate microelectronics assemblies.
  • Expertise in microelectronics packaging techniques including wire bonding and custom imprints.
  • Strong skills in electrical cabling assembly, soldering, crimping, and debugging hardware issues.

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