Micro-electronics Technician

Anduril Industries

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Work type
On-site
Location
Lexington, MA
Posted
today

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How this pay compares to similar roles

Similar $168k
$129k most similar roles pay here $205k

This listing doesn't post a salary. Most similar roles pay $142,437–$193,000.

Based on 240 similar postings.

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About Anduril Industries

Anduril Industries is a defense technology company that builds advanced hardware and software systems for national security, including autonomous drones, surveillance systems, and the Lattice AI command platform.

Anduril Industries currently has 1882 open roles on FindRole.

Listed pay typically runs $146,000–$194,000 across 1696 roles with salary data.

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At a glance

TL;DR · Micro-electronics Technician

Join the Anduril Imaging team as a Wire Bonding Technician, where you will work in a clean room environment to package and test custom infrared image sensors. Your daily tasks include handling silicon wafers, wire bonding image sensors into ceramic packages, conducting visual and electrical inspections, and operating custom test equipment to collect data. Ideal candidates have 5+ years of experience with precision test and measurement equipment, familiarity with microelectronics packaging tools like wire bonders, and proficiency in SolidWorks and scripting languages such as MATLAB or Python. This role requires meticulous attention to detail and the ability to work within a clean room setting on delicate hardware components.

What you'll do

  • Package, test, and wire bond custom infrared image sensors in a clean room.
  • Handle silicon wafers and perform automated probe testing on them.
  • Mount and wire bond image sensors into ceramic packages using precision tools.
  • Conduct visual and electrical inspections of sensor chip assemblies post-packaging.
  • Operate custom test equipment to collect image data from packaged sensors.

What we're looking for

  • 5+ years experience with precision test and measurement equipment for hardware development or production.
  • Experience in collecting data from devices under test using inspection and testing equipment.
  • Proficiency in working within a clean room environment on delicate microelectronics assemblies.
  • Expertise in microelectronics packaging, including wire bonding and custom imprints.
  • Strong skills in electrical cabling assembly, soldering, crimping, and debugging tasks.

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