Micro-electronics Technician - 2nd Shift

Anduril Industries

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Work type
On-site
Location
Hudson, NH
Posted
today

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Similar $155k
$121k most similar roles pay here $202k

This listing doesn't post a salary. Most similar roles pay $131,857–$177,925.

Based on 240 similar postings.

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About Anduril Industries

Anduril Industries is a defense technology company that builds advanced hardware and software systems for national security, including autonomous drones, surveillance systems, and the Lattice AI command platform.

Anduril Industries currently has 1882 open roles on FindRole.

Listed pay typically runs $146,000–$194,000 across 1696 roles with salary data.

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At a glance

TL;DR · Micro-electronics Technician - 2nd Shift

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Join Anduril Industries' AIRS team as a Micro-electronics Technician, contributing to the design and manufacture of high-performance cooled infrared cameras. You will execute complex wire bonding operations using manual, semi-automatic, and automated bonders, perform microelectronic assembly tasks with precision, and interpret technical documentation for adherence to specifications. Responsibilities include setting up and optimizing equipment, conducting quality assurance inspections, and collaborating with engineers to resolve production issues. Essential skills are proficiency in various wire bonding techniques, meticulous attention to detail, manual dexterity, and the ability to work under microscope conditions consistently. This role requires experience in microelectronic manufacturing or equivalent practical skills from a technical bootcamp, along with strong adherence to cleanroom protocols and ESD procedures.

Skills

Wire_Bonding Microelectronic_Assembly Adhesives_and_Epoxies Technical_Documentation Quality_Assurance Troubleshooting Cleanroom_Protocols ESD_Procedures Manual_Dexterity Micromagnetics_Westbond_Bonders Duroid_Ceramic_Substrates Temperature_Diodes Capacitors Alumina_Materials Reticle Indicator Microscope Bond_Puller

What you'll do

  • Execute precise wire bonding operations using manual, semi-automatic, and automated bonders.
  • Perform intricate microelectronic assembly tasks including adhesive application and component integration.
  • Interpret detailed technical documentation to ensure adherence to specifications and process requirements.
  • Set up, calibrate, and optimize wire bonding machinery for superior bond quality and throughput.
  • Conduct rigorous in-process and final inspections using measurement equipment to verify bond quality.
  • Troubleshoot technical issues during production and collaborate with team members for process improvements.

What we're looking for

  • Proven proficiency in various wire bonding techniques including manual, semi-automatic, and automated methods.
  • Experience in microelectronic assembly with precise adhesive and epoxy application skills.
  • Ability to read and interpret detailed technical documentation such as build sheets and engineering drawings.
  • Strong manual dexterity for consistent accuracy under a microscope throughout an entire shift.
  • Capability to set up, calibrate, and optimize wire bonding machinery independently.
  • Rigorous quality assurance practices including in-process and final inspections using measurement equipment.

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