Laser Component Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: Cupertino, CA
Salary: $150,400–$225,300 / yr
Posted: 13 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $177k

This role $188k

$126k $236k

below market most similar roles pay here above market

This role pays more than 67% of similar roles. Most pay $145,000–$208,200 — the blue band above. At the midpoint, this role pays about $188k versus about $177k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3497 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2702 roles with salary data.

Most-posted roles

View all roles at Apple Inc

At a glance

TL;DR · Laser Component Engineer

Role Posting Log in to save

The Laser Component Engineer joins the Laser Engineering Team within Camera Semiconductor Devices to lead laser component development. This role involves transforming laser design concepts into products ready for high-volume mass production. Key responsibilities include defining Engineering Requirement Specs, establishing spec correlations between component and system levels, and driving process integration flows with external vendors. The engineer will solve reliability and performance issues, review yield data, and explore new technologies for the internal roadmap. Required skills include a bachelor’s degree in physics or electrical engineering, experience in epitaxy processes, and experience transitioning projects to high-volume production. Preferred qualifications include an MS/PhD, experience with III-V optoelectronics devices like VCSELs and LEDs, and proficiency in data analysis using JMP and scripting for data inquiry.

Skills

III-V Optoelectronics VCSEL LEDs Edge-emitting Lasers PCSEL Epitaxy EPI Process Integration JMP Data Analysis Laser Engineering Device Design Fab Process

What you'll do

Design next-generation laser components and define Engineering Requirement Specifications (ERS).
Establish spec correlations between laser component levels and module or system levels.
Drive vendors to design robust process integration flows and develop key process steps.
Improve device performance and yield during the engineering development phase with vendors.
Solve reliability and performance issues observed on the module or system level.
Review vendor yield and performance data to provide approvals for engineering sample shipments.
Develop new laser device technologies aligned with the internal technology roadmap.

What we're looking for

Bachelor’s degree in physics, electrical engineering, or a similar discipline.
Experience in epitaxy (EPI) processes.
Experience transferring projects from engineering development to high-volume production.
MS/PhD in physics, electrical engineering, or a similar discipline (preferred).
3+ years of industry experience in device design, fab process, or process integration for III-V optoelectronics devices (preferred).
Epitaxy growth background on III-V optoelectronics devices (preferred).
Strong product engineering experience including data analysis in JMP and writing scripts (preferred).
Excellent communication, interpersonal, and cross-functional teamwork skills (preferred).