Hardware Engineer

Broadcom

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Quick summary

Work type: On-site
Location: San Jose, CA
Employment: Full-time
Posted: 20 days ago
Freshness: Confirmed live today
Closes: Mar 14, 2027
Nearby: 99+ roles within 25 mi

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How this pay compares to similar roles

Similar $186k

$134k most similar roles pay here $228k

This listing doesn't post a salary. Most similar roles pay $158,450–$213,375.

Based on 240 similar postings.

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About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 224 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 161 roles with salary data.

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At a glance

TL;DR · Hardware Engineer

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As a Hardware Engineer, you will join the Advanced Co-Packaged Optics team to spearhead the end-to-end development of integrated photonic and electronic systems. You will lead a cross-functional R&D team across optical, electrical, mechanical, firmware, and software disciplines to define product architecture, subsystem interfaces, and critical design tradeoffs. Your daily responsibilities include performing schematic capture, circuit simulation, SI/PI analysis, layout collaboration, and mechanical integration including fiber alignment. You will manage the full product development lifecycle from initial concept through prototype bring-up, validation testing, and mass production transfer. The role requires expertise in photonic and electronic IC design, optical engine packaging, and substrate or PCB development. Additionally, you will define ATE software requirements and manufacturing test algorithms to solve complex technical challenges within the integrated photonics and electronics domain.

Skills

Co-Packaged Optics (CPO) Integrated Photonics IC Design Circuit Simulation SI/PI Analysis Firmware Hardware Design ATE Software Product Development Lifecycle Manufacturing Test Fiber Alignment Optical Engine Packaging

What you'll do

Define CPO product architecture and subsystem interfaces across optical, mechanical, firmware, and PCB domains.
Lead the design of photonic/electronic ICs, optical engine packaging, and substrate development.
Oversee hardware design tasks including schematic capture, circuit simulation, SI/PI analysis, and fiber alignment.
Manage prototype bring-up, system-level troubleshooting, and validation testing for new products.
Drive project plans from initial concept through to mass production.
Define ATE software requirements and develop manufacturing test and tuning algorithms.
Provide technical support to customers and resolve complex field issues.

What we're looking for

Bachelor's degree in engineering or sciences with 12+ years of related experience.
Master's degree with 10+ years of related experience.
Ph.D. with 7+ years of related experience.
Experience leading cross-functional R&D teams across optical, electrical, mechanical, firmware, and software domains.
Expertise in photonic/electronic IC design, optical engine packaging, and substrate/PCB development.
Proficiency in hardware design including schematic capture, circuit simulation, SI/PI analysis, and layout collaboration.
Experience in prototype bring-up, system-level troubleshooting, and validation testing.
Ability to define ATE software requirements and manufacturing test/tuning algorithms.