Hardware and Systems Developer Intern

IBM

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: Rochester, MN
Employment: Intern
Posted: 17 days ago
Freshness: Confirmed live yesterday
Nearby: 11 roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $168k

$117k most similar roles pay here $218k

This listing doesn't post a salary. Most similar roles pay $126,807–$208,200.

Based on 240 similar postings.

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About IBM

IBM is a US-based global technology company providing hybrid cloud, AI, consulting, enterprise software, and IT infrastructure products and services.

IBM currently has 506 open roles on FindRole.

Listed pay typically runs $174,632–$197,165 across 5 roles with salary data.

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At a glance

TL;DR · Hardware and Systems Developer Intern

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Hardware and Systems Developer Intern 2027 joins the IBM Hardware and Systems team to design, prototype, and test next-generation high-performance systems. This role involves collaborating across disciplines to model and validate hardware components while supporting mechanical, thermal, electrical, optical, and logic designs. Daily responsibilities include participating in PCB layout, circuit design, firmware development, system bring-up, and conducting experiments for reliability and materials development. Candidates will utilize tools such as SolidWorks, Cadence, Allegro, and HFSS, alongside programming languages like Python, C/C++, or Bash to create automation scripts and perform data analysis. The work focuses on the technical challenges of developing compute platforms for advanced AI, cloud, and enterprise technologies. Key areas include fiber optics, photonics, signal integrity, and thermal design to solve complex infrastructure problems in high-performance computing environments.

Skills

SolidWorks Cadence Allegro Python C++ Bash MATLAB LabVIEW EDA CAD CFD FEM HFSS PCB Layout Firmware Development Embedded Systems Signal Integrity Power Integrity Optical Networking design-of-experiments (DOE

What you'll do

Design, model, and validate next-generation hardware and systems across multiple engineering disciplines.
Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools.
Participate in PCB layout, power and signal integrity, circuit design, and system bring-up.
Conduct experiments and analyze data to support reliability, process, and materials development projects.
Write scripts and automation tools using Python, C/C++, or Bash for testing and validation.
Perform firmware development and hardware debugging for embedded systems.
Execute specialized tasks in areas such as photonics, metallurgy, or heat transfer analysis.

What we're looking for

High School Diploma or GED required.
Bachelor's degree preferred.
Must be a B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related Engineering disciplines.
Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS).
Programming experience with Python, C/C++, or Bash for automation or data analysis.
Experience with firmware development, test automation, or embedded systems (preferred).
Hands-on experience with lab tools like LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment (preferred).
Familiarity with design-of-experiments (DOE) or project management in a research or lab environment (preferred).

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