This role pays more than
65%
of similar roles. Most pay
$142,300–$214,000
— the shaded band above.
At the midpoint, this role pays about
$194k
versus about
$178k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
474 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 474 roles with salary data.
The Failure Analysis Engineer - Server Systems Integration joins the team to own end-to-end failure analysis across hardware, firmware, silicon, and integration for Helios server platform bring-up. This role involves diagnosing system-level failures by determining if issues stem from firmware behavior, hardware design, component quality, power delivery, or cross-domain interactions. The engineer will perform structured debug using register dumps, BIOS/BMC logs, telemetry, and oscilloscope captures to identify root causes across PCIe, high-speed interconnects, and power sequencing. Key responsibilities include developing diagnostic strategies, automating data collection with Python and Linux tools, and leading cross-functional technical interfaces to drive corrective actions. The role requires expertise in server platforms, including CPLD, PMBus, and signal path dependencies, to resolve complex issues within the server and hyperscale computing domain while ensuring high platform quality through rigorous evidence-based analysis.
Lead end-to-end failure analysis and root cause ownership for Helios server platform bring-up and system-level failures.
Debug hardware, firmware, and silicon interactions across BIOS, BMC, CPLD, PMBus, and high-speed interconnects.
Determine if failures originate from firmware behavior, hardware design, component quality, silicon issues, or power delivery.
Execute structured debug plans using register dumps, log analysis, oscilloscope captures, and logic analyzer traces.
Validate firmware-controlled hardware behaviors across boot, initialization, and various failure states.
Automate data collection, log parsing, and failure correlation using Python and Linux scripting tools.
Manage technical interfaces with cross-functional teams to drive corrective actions and resolve complex system issues.
Create technical reports and 8D documentation to communicate root causes and recommended actions to stakeholders.
What we're looking for
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline (or equivalent hands-on experience).
Experience in end-to-end failure analysis and root cause ownership for server platform bring-up and system-level failures.
Expertise in debugging BIOS, BMC, CPLD, PMBus, POST, PCIe, and high-speed interconnect initialization.
Ability to isolate issues across firmware behavior, hardware design, silicon behavior, power delivery, and component quality.
Proficiency with oscilloscopes, logic analyzers, protocol tools, and other lab validation equipment.
Experience analyzing register dumps, BIOS/BMC logs, telemetry, and schematic evidence to drive corrective actions.
Proficiency in Python, Linux tools, and scripting for automating data collection and log parsing.
Knowledge of PCIe, high-speed interfaces, retimers, link training, and signal path dependencies (preferred).
Failure Analysis
Root Cause Analysis
Firmware
BIOS
BMC
IPMI
PCIe
Linux
System Architecture
Signal Integrity
Power Delivery
Networking
AI-assisted Engineering
Automation
Hardware Debugging
Python
Linux
PCIe
Ethernet
JTAG
Oscilloscopes
Logic Analyzers
Firmware
Hardware Debug
Root Cause Analysis
Test Automation
DevOps
HPC
Signal Integrity
System Bring-up
GPU Architecture
Failure Analysis
Python
Shell Scripting
Windows
Linux
Hardware Validation
Firmware
High Performance Computing
PCIe
HBM
GDDR
Oscilloscopes
Logic Analyzers
Soldering
IPC-A-610
MS Excel
Data Center Infrastructure
Physical Failure Analysis
SEM
TEM
Focused Ion Beam
FIB
Electron Microscopy
IC Fabrication
Advanced Packaging
De-processing
Cross-sectioning
Design of Experiments
DOE
Circuit Design