ElectroMechanical Packaging Engineer III

Lockheed Martin

Quick summary

Work type
On-site
Location
Englewood, COLittleton, CO
Salary
$89,300–$157,550 / yr
Posted
1 day ago

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $156k
This role $123k
$77k most similar roles pay here $205k

This role pays less than 85% of similar roles. Most pay $134,500–$177,500 — the shaded band above. At the midpoint, this role pays about $123k versus about $156k for comparable roles.

Based on 240 similar postings.

Employer

About Lockheed Martin

Lockheed Martin is a global aerospace, defense, and security company that designs, develops, and manufactures advanced technology systems, products, and services for government and commercial customers worldwide.

Lockheed Martin currently has 638 open roles on FindRole.

Listed pay typically runs $101,000–$181,113 across 321 roles with salary data.

Most-posted roles

View all roles at Lockheed Martin

At a glance

TL;DR · ElectroMechanical Packaging Engineer III

The Fleet Ballistic Missile Avionics team at Lockheed Martin is hiring an Electronics Packaging Engineer to work on advanced space flight avionics hardware, focusing on developing 3D concept models and ensuring they meet rigorous technical standards. This role involves collaborating with senior engineers to conduct trade studies, coordinate with various engineering disciplines for compliance assurance, and establish specifications for vendors. The engineer will also prepare detailed documentation and drawings for fabrication and assembly while working within an Integrated Product Team environment. Key responsibilities include identifying initial physical architecture, assisting in R&D trade studies, and resolving test anomalies during system-level testing. Ideal candidates have 3+ years of professional experience with CCA package design, CAD modeling (CREO, SolidWorks), and a strong understanding of GD&T. The position requires US Citizenship due to the need for obtaining and maintaining a DoD Top Secret clearance.

What you'll do

  • Support trade studies on electronic enclosure designs and provide technical data for design reviews.
  • Coordinate with various engineering disciplines to ensure compliant electronic packaging designs.
  • Establish specifications for contract assemblers and vendors, interfacing with quality assurance and purchasing.
  • Prepare all necessary drawings and documentation for the fabrication and assembly of designed hardware.
  • Develop electronic enclosure designs and performance requirements, conducting stress and thermal analysis.
  • Participate in iterative design reviews and resolve test anomalies during system level testing.
  • Generate and release design disclosure artifacts including technical presentations and end-of-year reports.

What we're looking for

  • 3+ years of professional experience in electronics packaging or related field.
  • Bachelor’s degree in Mechanical or Aerospace Engineering, or equivalent technical discipline.
  • Experience with electronic enclosure designs and thermal analysis.
  • Proficiency in CAD modeling software such as CREO or SolidWorks.
  • Ability to obtain and maintain a DoD Top Secret clearance; US Citizenship required.
  • Knowledge of Geometric Dimensioning and Tolerancing (GD&T).
  • Strong communication skills for technical presentations and design reviews.

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