Advanced DRAM Plasma Etch Engineer

IBM

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Confirmed live yesterday

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TL;DR · Advanced DRAM Plasma Etch Engineer

JOB TITLE: Advanced DRAM plasma etch engineer The Senior DRAM Plasma Etch Engineer joins the IBM Research team to drive advanced DRAM technology research and development. This role focuses on enabling next-generation memory technologies by developing leading-edge plasma dry etch solutions and pattern transfer technologies for advanced DRAM architectures. The engineer will develop novel dry etch processes to enable future physical and electrical architectures, collaborating with cross-functional teams in process integration, patterning, metrology, and device engineering. Key responsibilities include providing technical leadership for plasma dry etch development, influencing technology roadmaps, and managing complex development programs with external partners. Required expertise includes plasma dry etch fundamentals, reactor operation, process characterization, and integration. Candidates must utilize experimental design, statistical data analysis, and process optimization methodologies to improve capability, yield, and reliability for 3D devices and other leading-edge semiconductor technologies.

What you'll do

  • Develop novel dry etch processes to enable future DRAM physical and electrical architectures.
  • Implement advanced etch solutions from initial concept through manufacturing implementation.
  • Lead complex development programs across multi-functional teams and external partners.
  • Influence DRAM technology roadmaps for next-generation plasma dry etch development.
  • Drive process capability, yield, and reliability improvements through data-driven experimentation.
  • Partner with equipment and materials suppliers to overcome emerging technology challenges.
  • Perform process characterization and optimization using statistical data analysis.

What we're looking for

  • Doctorate Degree (preferred).
  • Minimum 5 years of plasma dry etch process development experience and DRAM technology development experience.
  • Demonstrated expertise in advanced semiconductor etch process development and integration.
  • Strong understanding of plasma etch fundamentals, reactor operation, process characterization, and process integration.
  • Experience with experimental design, statistical data analysis, and process optimization methodologies.
  • Proven ability to lead multi-functional projects and communicate effectively with internal and external collaborators.
  • 8+ years of DRAM technology development experience (preferred).
  • 8+ years of advanced plasma dry etch experience (preferred).
  • 5+ years developing or influencing dry etch roadmaps for DRAM technologies (preferred).
  • Experience developing advanced DRAM, 3D device, or other leading-edge semiconductor technologies (preferred).
  • Demonstrated success leading technical teams, mentoring engineers, or managing complex development programs (preferred).
  • Strong publication, patent, or industry-recognized technical achievement record (preferred).
  • Experience with process transfer and yield improvement (preferred).

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