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Principal IC Packaging Engineer

Qualcomm

San Diego, CA 44 days ago $201,600–$302,400
Actively hiring Confirmed live yesterday High trust Above market
RDL Wafer Bonding Flip Chip Wire Bond SiP 2.5D Packaging Fan-out Bridge FCBGA MCM High-Density Interconnect Failure Analysis Substrate Manufacturing HVM
8+ yrs exp
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