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Staff IC Packaging Engineer

Qualcomm

San Diego, CA 23 days ago $154,000–$231,000
Actively hiring Competitive pay
FCCSP FCBGA SiP/Modules RDL-based packages 2.5D/3D integration Design of Experiments Best Known Methods Process Control Plans DFM FMEA SPC/QC Reliability Testing Failure Analysis Flip Chip Wire Bond Substrate Technologies Wafer-Level Processes Laser Groove Technology Six Sigma
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Principal Packaging Engineer | Microsoft Careers

Microsoft

Redmond, WA 26 days ago $139,900–$274,800
Actively hiring Competitive pay
AI Python Cryogenic Materials Microwave Device Packaging Kubernetes Terraform CI/CD Docker GitHub Jenkins PostgreSQL AWS Azure Google Cloud Platform GitLab Confluence Jira Slack Zoom Microsoft Teams
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Photonic Packaging Engineer

Cisco

Carlsbad, CA 58 days ago $134,300–$195,400
Actively hiring Competitive pay
Python C# .NET SQL JMP AWS Kubernetes Terraform Docker CI/CD Prometheus Grafana AI ML Machine Vision Photonics Fiber Optics Semiconductor Lasers
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Principal IC Packaging Engineer

Qualcomm

San Diego, CA 146 days ago $201,600–$302,400
Actively hiring Above market
RDL Wafer Bonding Flip Chip Wire Bond SiP Materials Science Equipment Expertise High-Density Interconnect Design Reliability Standards Test Methods Qualification Procedures Failure Analysis Techniques Substrate Manufacturing Processes Design Rules Technical Project Management Cross-Functional Team Leadership
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