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Active Keyword: 3D Memory Chip Architect and Design Remove filter Clear all

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Principal Engineer, Memory-Centric AI Compute Architect

Qualcomm

Hillsboro, OR 3 days ago $192,000–$288,000
Actively hiring Posted this week Verified listing Above market
Python C C++ CNN Transformer LLM RNN HBM Memory_Controller Dataflow Bus_Protocols Tensor_Cores Near_Memory_Computing Performance_Modeling_Tools 2.5D_3D_Integration DRAM Perl
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Principal Engineer, System Power for Advanced 2.5D/3D High-Performance Compute

Qualcomm

San Diego, CA 3 days ago $192,000–$288,000
Actively hiring Posted this week Verified listing Above market
Voltus Redhawk SPICE Virtuoso C C++ Python Perl IBIS Verilog-A RLC networks EDA tools Power Integrity Signal Integrity Chiplets PMIC architecture Thermal Modeling High-Frequency Signal Assessment Model Order Reduction
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