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Senior Director of Packaging Engineering

Amd

San Jose, CA 19 days ago $268,960–$403,440
Actively hiring Confirmed live yesterday High trust Above market
IC Packaging Mechanical Design Chiplet Architecture 2.5D/3D Integration High-Volume Manufacturing (HVM) New Product Introduction (NPI) FEA CFD S-parameters SerDes PDN Design WLCSP Flip-Chip System-in-Package (SiP)