Principal Thermal Mechanical Engineer
Flex (Flextronics)
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How this pay compares to similar roles
This role pays more than 71% of similar roles. Most pay $166,637–$235,750 — the shaded band above. At the midpoint, this role pays about $226k versus about $201k for comparable roles.
Based on 240 similar postings.
Employer
HP Inc. is a global technology company that develops and sells personal computers, printers, and related supplies and services. Its products include laptops, desktops, workstations, and printing solutions for consumers and businesses worldwide.
HP Inc. currently has 79 open roles on FindRole.
Listed pay typically runs $130,700–$205,200 across 76 roles with salary data.
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At a glance
As a senior Thermal and Performance Architect at HP, you will lead multi-year technology roadmaps for thermal engineering, focusing on innovations in Phase Change Materials (PCM), vapor chambers, fans, heat pipes, and active cooling solutions. You will collaborate with silicon vendors and cross-functional teams to co-design systems optimized for performance and efficiency, ensuring compliance with enterprise standards. Your responsibilities include driving advanced CFD workflows, establishing simulation frameworks, and architecting thermal tuning algorithms. With expertise in tools like Flotherm XT, FLOEFD, Icepak, PTC Creo, SolidWorks, and ANSYS, you will mentor engineers and guide the development of cutting-edge thermal solutions across various product lines, impacting multiple disciplines and platforms.
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