Reliability Engineer

Broadcom

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Fort Collins, CO
Salary
$109,700–$175,500 / yr
Employment
Full-time
Posted
15 days ago
Freshness
Confirmed live today
Closes
Mar 29, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $179k
This role $143k
$96k $239k
below market most similar roles pay here above market

This role pays less than 75% of similar roles. Most pay $143,375–$214,250 — the blue band above. At the midpoint, this role pays about $143k versus about $179k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · Reliability Engineer

The Reliability Engineer joins the Global Operations Quality Assurance Team to support leading edge Silicon and Packaging solutions. This hands-on role involves interacting with various business units to perform reliability qualifications for new products. Key responsibilities include generating hardware specifications for external board vendors, conducting board design reviews, and performing thermal solution verification prior to PCB fabrication. The engineer will also manage biased stress project schedules, convert HTOL vectors for in-house systems, and provide technical support for the REL Lab. Required skills include hardware design, ASIC test engineering, and experience with schematic and layout review. The role requires proficiency in reliability qualification stress tests like HTOL, HTS, TC, THB, uHAST, and bHAST, while adhering to industry standards such as JEDEC and Mil-Std.

What you'll do

  • Perform reliability qualifications for new silicon and packaging solutions.
  • Generate hardware specifications for external board vendors.
  • Conduct board design reviews and thermal solution verifications prior to PCB fabrication.
  • Convert HTOL vectors to run on in-house MCC HTOL systems.
  • Develop biased and unbiased stress testing plans for critical projects.
  • Manage biased stress project schedules to meet internal and external milestones.
  • Perform board and socket debug for setup or vector issues.
  • Complete initial biased stress certifications for products.

What we're looking for

  • Strong hardware design and or ASIC test engineering experience is a must.
  • BS Degree in Engineering (Electrical, Mechanical, Computer) or related field and 8+ years of related experience is desired.
  • Less than 8 years of related experience or a degree in other Engineering or Science disciplines will be considered on an individual basis.
  • Minimum of 5 years of experience in a REL Lab environment (preferred).
  • Understanding of Reliability Qualification stress tests including HTOL, HTS, TC, THB, uHAST, bHAST, Preconditioning / Reflow Test engineering experience (preferred).
  • Schematic design and PCB layout design / review (preferred).
  • Familiarity with industry IC stress test standards such as JEDEC and Mil-Std (preferred).
  • Background in Automated Test Equipment (ATE), Test Engineering, IC Chip Design or Hardware Design would be a plus (preferred).

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