Package Mechanical Design Engineer

Cisco

Remote

Quick summary

Work type: Remote
Location: San Jose, CA
Salary: $165,000–$241,400 / yr
Posted: 3 days ago
Closes: Jul 31, 2026
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $167k

This role $203k

$116k most similar roles pay here $255k

This role pays more than 79% of similar roles. Most pay $136,400–$197,500 — the shaded band above. At the midpoint, this role pays about $203k versus about $167k for comparable roles.

Based on 239 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 183 open roles on FindRole.

Listed pay typically runs $165,000–$241,400 across 183 roles with salary data.

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View all roles at Cisco

At a glance

TL;DR · Package Mechanical Design Engineer

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As a Package Mechanical Design Engineer at Cisco’s Silicon One team in San Jose or remotely within the US, you will lead mechanical and thermomechanical simulation efforts for high-performance ASICs and complex silicon/package/board assemblies, ensuring product reliability through advanced finite element analysis (FEA) and solder joint reliability simulations. You will work with a globally distributed team to develop simulation methodologies and reliability strategies, automate workflows using Python or Fortran, and provide design recommendations based on correlation of simulation results with testing data. The role requires hands-on experience in FEA tools like ABAQUS or ANSYS, familiarity with CAD tools such as Creo, and knowledge of solder joint reliability analysis methodologies including Coffin-Manson and Darveaux models. Ideal candidates have a background in mechanical engineering and 5+ years of experience in electronics packaging or board-level reliability simulation.

Skills

Python FEA ABAQUS ANSYS CAD Creo GD&T JEDEC IPC flip chip 2.5D/3D heterogeneous integration solder joint reliability thermal cycling drop test mechanical testing viscoplasticity fatigue modeling nonlinear material modeling

What you'll do

Perform advanced FEA to evaluate thermomechanical reliability of ASIC packages and board-level assemblies.
Lead solder joint reliability simulations using industry methodologies like Coffin-Manson and Darveaux.
Develop and automate simulation workflows for efficiency and repeatability.
Provide design recommendations and reliability sign-off guidance to cross-functional teams.
Correlate simulation results with real-world testing data to enhance model accuracy.

What we're looking for

Bachelor’s degree in mechanical engineering or related field with 7+ years of experience.
Expertise in thermomechanical simulation and solder joint reliability analysis for semiconductor packages.
Proficiency with FEA tools like ABAQUS or ANSYS, including nonlinear material modeling.
Experience correlating simulation results with reliability testing data to enhance model accuracy.
Strong scripting skills using Python, Fortran, or similar tools for automation and data processing.

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