Micro-electronics Technician

Anduril Industries

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Work type
On-site
Location
Lexington, MA
Posted
today

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How this pay compares to similar roles

Similar $172k
$128k most similar roles pay here $210k

This listing doesn't post a salary. Most similar roles pay $143,987–$200,975.

Based on 240 similar postings.

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About Anduril Industries

Anduril Industries is a defense technology company that builds advanced hardware and software systems for national security, including autonomous drones, surveillance systems, and the Lattice AI command platform.

Anduril Industries currently has 1972 open roles on FindRole.

Listed pay typically runs $146,000–$194,000 across 1790 roles with salary data.

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At a glance

TL;DR · Micro-electronics Technician

Join the Anduril Imaging team as a Wire Bonding Technician, where you will work in a clean room environment to package and test custom infrared image sensors. Your daily tasks include handling silicon wafers, wire bonding image sensors into ceramic packages, conducting visual and electrical inspections, and operating specialized test equipment to collect image data. Ideal candidates have 5+ years of experience with precision measurement tools and familiarity with microelectronics packaging processes such as wire bonding and custom imprints. Proficiency in SolidWorks and scripting languages like MATLAB or Python is a plus. This role requires meticulous attention to detail and the ability to work within clean room standards, contributing to cutting-edge imaging solutions for security challenges faced by America and its allies.

What you'll do

  • Package, test, and wire bond custom infrared image sensors in a clean room.
  • Handle silicon wafers and perform automated probe testing.
  • Mount and wire bond image sensors into ceramic packages using precision equipment.
  • Conduct visual and electrical inspections of sensor chip assemblies post-packaging.
  • Operate custom test equipment to collect image data from liquid nitrogen tests.

What we're looking for

  • 5+ years experience with precision test and measurement equipment in development or production hardware.
  • Experience working within a clean room environment for microelectronics assembly.
  • Proficiency in operating custom test equipment to collect image data from devices under test (DUTs).
  • Expertise in handling delicate hardware, including wire bonding and visual/electrical inspections of sensor chip assemblies.
  • Prior experience with microelectronics packaging techniques such as wirebonders and custom imprints.
  • Strong background in electrical cabling assemblies, soldering, crimping, and debugging tasks.

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