Mechanical Engineer

Broadcom

Confirmed live today High trust

Quick summary

Work type: On-site
Location: San Jose, CA
Salary: $121,900–$195,000 / yr
Employment: Full-time
Posted: 70 days ago
Freshness: Confirmed live today
Closes: Feb 14, 2027
Nearby: 99+ roles within 25 mi

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $163k

This role $158k

$112k $215k

below market most similar roles pay here above market

This role pays less than 56% of similar roles. Most pay $126,562–$199,556 — the blue band above. At the midpoint, this role pays about $158k versus about $163k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · Mechanical Engineer

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JOB TITLE: Mechanical Engineer The Mechanical Engineer joins the Compute and Switching Group to support the full hardware development cycle from concept through production. This role focuses on high-power system enclosure design, system bring-up, and validation for advanced system-on-chip devices. Key responsibilities include leading thermo-mechanical lab operations, managing liquid cooling infrastructure, and developing thermal solutions like heatsinks, vapor chambers, and manifolds. The engineer will design rack-mount enclosures, conduct system-level thermal tests, and troubleshoot issues in high-power prototypes. Required technical skills include proficiency in PTC Creo and Windchill PLM, along with experience in thermal measurement technologies, sensors, and lab instrumentation. The role requires knowledge of datacenter rack standards, EMI/EMC shielding, and high-speed cabling design to solve critical constraints in space, thermal management, manufacturability, and scalability for next-generation switch platforms.

Skills

PTC Creo Windchill PLM Liquid Cooling Thermal Management Enclosure Design Heatsinks Vapor Chambers BGA Socket Thermal Validation EMI/EMC Shielding EIA-310 OCP NEBS Thermal Cycling High-speed Cabling Design OSFP Copper NPI Production System Bring-up

What you'll do

Lead thermo-mechanical lab operations including liquid cooling infrastructure and BGA socket thermal validation.
Own thermo-mechanical system component validation and troubleshooting from concept through production.
Develop and qualify advanced thermal solutions like heatsinks, vapor chambers, and liquid cooling manifolds.
Conduct system-level thermal tests and correlate experimental results with simulations.
Define and execute thermal test plans including all necessary documentation and data reporting.
Design rack-mount enclosures and system components based on production requirements.
Manage vendor relationships for thermal solution components including fans and cooling hardware.
Troubleshoot and resolve system-level thermal issues in high-power prototypes.

What we're looking for

Bachelor’s degree in Mechanical Engineering or a related field.
8+ years of experience in enclosure design and thermal test validation.
Proficiency in PTC Creo and Windchill PLM.
Strong background in heatsinks, heat pipes, vapor chambers, and liquid cooling systems.
Hands-on experience with thermal measurement technologies, sensors, and lab instrumentation.
Knowledge of datacenter rack standards (EIA-310, OCP).
Familiarity with EMI/EMC shielding and compliance design considerations.
Experience with high-speed cabling design and routing, including bend-radius management and cable retention.

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