IP Integration Engineer

Broadcom

Quick summary

Work type
On-site
Location
Fort Collins, CO
Salary
$91,000–$146,000 / yr
Posted
19 days ago
Closes
Nov 14, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $174k
This role $118k
$77k most similar roles pay here $225k

This role pays less than 88% of similar roles. Most pay $142,400–$204,750 — the shaded band above. At the midpoint, this role pays about $118k versus about $174k for comparable roles.

Based on 239 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 61 open roles on FindRole.

Listed pay typically runs $120,000–$192,000 across 60 roles with salary data.

Most-posted roles

View all roles at Broadcom

At a glance

TL;DR · IP Integration Engineer

The IP Integration Engineer role at Broadcom’s ASIC Product Division involves working within a cross-functional design team focused on developing die-to-die and die-to-memory PHY IPs used in custom silicon ASIC products. This position requires the candidate to develop methodologies for integrating these IPs into large, complex 2.5D and 3.5D ASICs while also contributing to their physical composition. Key responsibilities include collaborating with various teams such as analog design, digital design, and physical composition to optimize size and power delivery for high IO density PHYs, analyzing power integrity issues, and creating detailed integration documentation. The ideal candidate should have a strong background in ASIC design flow tools like Cadence Innovus, experience with timing reports from static timing analysis tools, and proficiency in scripting languages such as TCL or Python. Additionally, familiarity with AI tools is desired to enhance the development process within this high-scale semiconductor environment.

What you'll do

  • Develop a detailed understanding of Broadcom's die-to-die PHYs.
  • Optimize size and power delivery for high IO density PHYs with analog teams.
  • Analyze power integrity issues in various use cases and workloads.
  • Write comprehensive documentation for integrating PHY IP into ASICs.
  • Collaborate with physical composition teams on 2.5D and 3.5D ASIC integration.
  • Develop quality checklists to ensure the reliability of PHY IPs.
  • Support customer inquiries related to PHY integration and issues.

What we're looking for

  • Bachelor’s Degree in Electrical or Computer Engineering, 5+ years related experience; or Master's degree, 3+ years related experience.
  • Proficient in Cadence Innovus toolset and understanding of modern FET architecture including FinFET and GAA topologies.
  • Strong knowledge of ASIC design flow including RTL, synthesis, timing analysis, floorplanning, power planning, P&R, LVS, DRC.
  • Excellent verbal and written communication skills with ability to work effectively in a team environment.
  • Capable of multitasking, managing multiple technical issues simultaneously, and meeting strict project deadlines.
  • Experience reading and interpreting timing reports from static timing tools like Tempus or Primetime.

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