At Qualcomm Technologies, the CAD Component team within Engineering Services Group seeks a senior PCB layout engineer with 5+ years of experience in high-speed design and HDI packaging. This role involves designing and documenting printed circuit board layouts for advanced server and compute platforms, including form factor accurate test systems and high-volume boards. You will work on multi-layer stack-ups and utilize cutting-edge manufacturing techniques such as stacked micro-vias and sequential lamination. The ideal candidate is proficient in Siemens/Mentor Xpedition or Cadence Allegro PCB design software and has experience with RF, analog, and high-speed digital circuits. Collaboration with internal teams in the U.S. and India, as well as external vendors, is key to delivering high-performance PWB solutions. Strong DFM analysis skills using Valor and CAM350 tools are essential, along with expertise in EMI mitigation techniques and IDF/EMN file exchange processes.
Skills
SiemensMentorXpedition
CadenceAllegroPCBdesignsoftware
ValorCAM350tools
RF
Analog
High-speeddigitalcircuits
DDR5
HDMI
PCIe
SATA
MIPI
USB23x
GigE
LPDDRbreakouts
complexstackups
EMImitigationtechniques
IDFEMNfileexchange
What you'll do
Design PCB layouts for reference server and PC compute systems.
Engineer high-speed multi-layer stack-ups for advanced layout designs.
Utilize stacked micro-vias, sequential lamination, and small-pitch package design rules.
Collaborate with internal teams to deliver high-performance PWB solutions.
Liaise with stakeholders and vendors to support PCB fabrication and assembly.
What we're looking for
5+ years of experience in high-speed PCB design.
5+ years of experience in PCB design for HDI and high-density electronics packaging.
Proficient in Siemens/Mentor Xpedition or Cadence Allegro PCB design software.
Us, Ca, Santa Clara, US30 days ago
$168,000–$264,500
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