At a glance
AI generatedAs a senior process engineer on the advanced packaging team, you will play a crucial role in developing cutting-edge technologies such as Through-Silicon Vias (TSV), Trench Gap Filling (TGV), Wafer Level Packaging (WLP), and Panel plating. Your daily responsibilities include designing and optimizing deposition processes using Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition (PVD), or Electrochemical Deposition (ECD). You will work closely with a multidisciplinary team to ensure the successful implementation of these technologies at scale, addressing complex challenges in semiconductor manufacturing.
Skills
What you'll do
What we're looking for
Market check
This listing doesn't show a salary. Similar roles on FindRole typically pay $117,000–$201,846.
Peer median band
$117,000–$201,846
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$135,000–$185,275
Middle half of comparable postings.
Based on 238 comparable postings.
* 240 is the maximum number of comparable postings sampled.
Employer
Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.
Lam Research currently has 217 open roles on FindRole.
Listed pay typically runs $114,000–$231,000 across 106 roles with salary data.
Most-posted roles
More like this
Lam Research
Lam Research
Lam Research
Lam Research