| Microsoft Careers

Microsoft

Quick summary

Work type
On-site
Location
Redmond, WA
Salary
$142,800–$274,800 / yr
Posted
54 days ago

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $181k
This role $209k
$101k most similar roles pay here $293k

This role pays more than 95% of similar roles. Most pay $155,000–$207,350 — the shaded band above. At the midpoint, this role pays about $209k versus about $181k for comparable roles.

Based on 238 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 1103 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 985 roles with salary data.

Most-posted roles

View all roles at Microsoft

At a glance

TL;DR · | Microsoft Careers

Join our dynamic AISiE team as a Principal Physical Design Engineer, where you will lead the development of TFM (tool, flow, methodology) for physical design tasks at block, sub-chip, or full-chip levels, focusing on Place and Route (PnR), Static Timing Analysis (STA), Physical Verification (PV), Formal Equivalency Verification (FEV), Functional ECO, Clocking Construction, and IR-Drop/EM. Your day-to-day will involve improving physical design efficiency, implementing methodologies for sign-off in static timing and verification areas, conducting reviews to resolve issues, and guiding junior engineers. You should have expertise with Synopsys Fusion Compiler, Cadence Innovus, Siemens Calibre, TCL scripting, and Python, along with a strong background in semiconductor design principles and leading-edge tapeouts of complex ASICs. This role demands a Bachelor's or Master’s degree in Electrical/Computer Engineering and over 10 years of experience in physical design projects.

What you'll do

  • Lead the development of PnR convergence recipes for block and subsystem designs.
  • Improve physical design efficiency and performance through innovative methodologies.
  • Ensure sign-off of blocks and subsystems in static timing, verification, and low power areas.
  • Implement functional ECO with minimal impact on physical design integrity.
  • Design global clocking schemes at SOC and sub-chip levels to optimize performance.

What we're looking for

  • 10+ years of experience in blocks level place and route for complex ASICs.
  • Expertise in physical design EDA tools like Synopsys Fusion Compiler, Cadence Innovus, and Siemens Calibre.
  • Proven track record of leading successful physical design projects and delivering high-quality semiconductor products.
  • Strong understanding of semiconductor design principles and methodologies.
  • Adequate scripting skills in TCL and Python for automation and optimization.
  • Effective communication and leadership abilities to drive cross-functional collaboration.
  • Good understanding of foundry tech files and rule decks.

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