Careers

Lam Research

Hybrid

Quick summary

Work type: Hybrid
Location: Tualatin, OR
Posted: 100 days ago
Closes: Sep 1, 2026
Nearby: 99+ roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $158k

$116k most similar roles pay here $200k

This listing doesn't post a salary. Most similar roles pay $130,882–$185,850.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 376 open roles on FindRole.

Listed pay typically runs $105,000–$231,000 across 184 roles with salary data.

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At a glance

TL;DR · Careers

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As a senior process engineer on the advanced packaging team, you will play a crucial role in developing cutting-edge technologies such as Through-Silicon Vias (TSV), Trench Gap Filling (TGV), Wafer Level Packaging (WLP), and Panel plating. Your daily responsibilities include designing and optimizing deposition processes using Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Physical Vapor Deposition (PVD), or Electrochemical Deposition (ECD). You will work closely with a multidisciplinary team to ensure the successful implementation of these technologies at scale, addressing complex challenges in semiconductor manufacturing.

Skills

Atomic_Layer_Deposition Chemical_Vapor_Deposition Physical_Vapor_Deposition Electrochemical_Deposition

What you'll do

Develop advanced packaging technologies such as TSV, TGV, WLP, and Panel plating.
Conduct research on Atomic Layer Deposition (ALD) processes for semiconductor applications.
Perform experiments using Chemical Vapor Deposition (CVD) techniques in a lab setting.
Utilize Plasma Enhanced Chemical Vapor Deposition (PECVD) methods to enhance device performance.
Implement Physical Vapor Deposition (PVD) processes to improve material properties.
Execute Electrochemical Deposition (ECD) procedures for advanced semiconductor manufacturing.

What we're looking for

Experience in Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD).
Proficiency in Plasma Enhanced Chemical Vapor Deposition (PECVD) techniques.
Expertise in Physical Vapor Deposition (PVD) processes.
Knowledge of Electrochemical Deposition (ECD) methods.
Background in advanced packaging technology development.

Hybrid

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